Wi-Fi Chipset Market to Witness Huge Growth by Key Players: Qualcomm Technologies Inc, Broadcom Inc, Intel Corporation, Texas Instruments Incorporated and more.

Global Wi-Fi Chipset Market 2020-2026, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market. An exclusive data offered in this report is collected by research and industry experts team.

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The Wi-Fi chipset market was valued at USD 19.7 billion in 2020 and is estimated to reach USD 25.2 billion by 2026; it is anticipated to grow at a CAGR of 4.2% during the forecast period (2021–2026).

Top Key Players Profiled in the Wi-Fi Chipset Market:
• Qualcomm Technologies Inc. (US)
• Broadcom Inc. (US)
• MediaTek Inc. (Taiwan)
• Intel Corporation (US)
• Texas Instruments Incorporated (US)

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The tri band segment is expected to account for a 24% share of the overall Wi-Fi chipset market by 2026. The high growth of the tri-band Wi-Fi chipset segment is attributed to the use of 802.11ac in smartphones and Wi-Fi access point equipment. The upcoming 802.11ax or Wi-Fi 6 is expected to provide 160 MHz channel widths to accommodate data-hungry applications over the 6 GHz band; it could lead to the adoption of Wi-Fi 6 and next-generation security of WPA3

With the emergence of several smart appliances that can connect to the internet and smartphones, the IoT technology market for the consumer electronics segment is expected to witness healthy growth, and so is the Wi-Fi chipset market. Therefore, it tends to hold the major share of the Wi-Fi chipset market during the forecast period.

APAC accounted for the largest share of the global Wi-Fi chipset market and is expected to become the largest market for Wi-Fi chipsets by 2026, accounting for an estimated 50% share of the market, in terms of volume There are several consumer electronics product manufacturers operating in China, South Korea, and Japan, such as Samsung Electronics Co. Ltd. (South Korea), Huawei Technologies Co. Ltd. (China), ZTE Corporation (China), and Sony Corporation (Japan).

Breakdown of primary participants’ profile:
• By Company Type: Tier 1 - 20%, Tier 2 - 55%, and Tier 3 - 25%
• By Designation: C-level Executives - 50%, Director - 25%, and Managers - 25%
• By Region: North America - 60%, Europe - 20%, APAC - 10%, and RoW - 10%

Research Coverage:
This research report categorizes the Wi-Fi chipset market by on standard, multiple-input multiple-output (MIMO) configuration, band, vertical, and end-use application and region. The report describes the major drivers, restraints, challenges, and opportunities pertaining to the Wi-Fi chipset market and forecasts the same till 2026.

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This release was published on openPR.