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Die Bonder Equipment Market to 2027, Future Outlook, COVID-19 Impact Analysis, Forecast 2021-2027

02-18-2021 06:18 AM CET | Industry, Real Estate & Construction

Press release from: Orion Market Reports

The global die bonder equipment market is expected to grow from USD 820 million in 2019 to USD 972 million with an annual growth rate of 3% through 2024. Key factors driving the growth of the Die Bonder Equipment market include increasing demand for small electronic components and increasing adoption of stackable die technology in IoT devices.

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A full report of Die Bonder Equipment Market available at: https://www.orionmarketreports.com/die-bonder-equipment-market/47227/

Key Market Players

• ASM Pacific Technology Limited
• BE Semiconductor Industries N.V. (Besi)
• Dr. Tresky AG
• Finetech GmbH & Co KG.
• Kulicke & Soffa Industries, Inc.
• MicroAssembly Technologies, Ltd. (MAT)
• Mycronic AB
• Palomar Technologies Inc.
• SET Corporation SA
• West·Bond, Inc.

Die Bonder Equipment Market Segmentation

By Type

• Manual Die Bonders
• Semiautomatic Die Bonders
• Fully Automatic Die Bonders

By Bonding Technique

• Epoxy
• Eutectic
• Soft Solder
• Others

By Supply Chain Participant:

• OSAT Companies
• IDM Firms

By Device:

• Optoelectronics
• MEMS And MOEMS
• Power Devices

By Application:

• Consumer Electronics
• Automotive
• Industrial
• Telecommunications
• Healthcare
• Aerospace & Defense

Recent Developments

o Market Overview and growth analysis
o Import and Export Overview
o Volume Analysis
o Current Market Trends and Future Outlook
o Market Opportunistic and Attractive Investment Segment

Geographic Coverage

o North America Market Size and/or Volume
o Latin America Market Size and/or Volume
o Europe Market Size and/or Volume
o Asia-Pacific Market Size and/or Volume
o Rest of the world Market Size and/or Volume

Key Questions Answered by Die Bonder Equipment Market Report

• What was the Die Bonder Equipment Market in 2020 and 2021; what are the estimated growth trends and market forecast (2021-2027).
• What will be the CAGR of Die Bonder Equipment Market during the forecast period (2021-2027)?
• Which segments (product type/applications/end-user) were most attractive for investments in 2018? How are these segments are expected to grow during the forecast period (2021-2027)?
• Which manufacturer/vendor/players in the Die Bonder Equipment Market was the market leader in 2018?
• Overview on the existing product portfolio, products in the pipeline, and strategic initiatives taken by key vendors in the market.

Media Contact:

Company Name: Orion Market Reports
Contact Person: Mr. Anurag Tiwari
Email: info@orionmarketreports.com
Contact no: +91 780-304-0404

About Us:

Orion Market Reports (OMR) endeavors to provide exclusive blend of qualitative and quantitative market research reports to clients across the globe. Our organization helps both multinational and domestic enterprises to bolster their business by providing in-depth market insights and most reliable future market trends. Our reports address all the major aspects of the markets providing insights and market outlook to global clients.

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