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Scantinel Photonics launches groundbreaking scanning FMCW lidar silicon chip for autonomous vehicles

02-16-2021 03:33 PM CET | Business, Economy, Finances, Banking & Insurance

Press release from: Scantinel Photonics GmbH

Photonic integrated circuit (PIC) from Scantinel Photonics

Photonic integrated circuit (PIC) from Scantinel Photonics

Ulm, (February 16.02. 2021)
Scantinel Photoncis GmbH, a leading worldwide FMCW Lidar Company, launches the first chip-scale massive-parallelized scanning lidar system (OEATM) based on a photonic integrated circuit (PIC). The PIC has 256 channels and enables full performance long range (> 300m) solid state scanning.
The development and fabrication of the PIC was made in cooperation with imec, a world-leading research and innovation hub in nanoelectronics and digital technologies.
A CMOS-compatible fabrication of the PIC at wafer-level significantly reduces cost, size, weight, and power for a lidar system and can be scaled for high volume applications, like autonomous vehicles.
Using standard CMOS fabs gives Scantinel the compelling advantage of building FMCW Lidar on a chip at a highly attractive and competitive price.
„Our unique Optical Enhanced Array (OEATM) is combining the PIC with Scantinel’s own developed optics, which is certainly a groundbreaking development “, said Vladimir Davydenko, one of the co-founders of Scantinel.
„A first FMCW Lidar demonstrator using the PIC with the Optical Enhanced Arrays (OEATM) will be available by mid of this year” adds Dr. Michael Richter – Managing Director of Scantinel Photonics.

Scantinel Photonics GmbH
Hirschstraße 4
89073 Ulm,Germany

Scantinel Photoncis GmbH is a leading worldwide FMCW Lidar Company of next generation lidar technology. Scantinel Photonics GmbH is a venture company of ZEISS AG.

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