Press release
E-Scrap and Printed Circuit Board (PCB) E-Scrap Market by Growing Technology Trends with Business Opportunities 2027 – Boliden Group, Dowa Holdings, Escrap India, Greentec
E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
E-scrap and printed circuit board (PCB) e-scrap is an electronic waste, which defines discarded electronic devices. Used electronics which are meant for reuse, resale, recycling via material recovery are also considered electronic waste. The process of electronic waste is a combination of manual as well as mechanical dismantling, size reduction, and sending hazardous waste for final disposal and metal components for processing. The growing government regulations refer to the proper management and disposal of e-scrap and printed circuit board (PCB) e-scrap in emerging economies such as the Asia Pacific is driving the growth of the market
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Competitive Landscape: E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Boliden Group, Dowa Holdings Co. Ltd, Escrap India, GCL Recycling and Refining Inc., Greentec, MAIREC Edelmetallgesellschaft mbH, MIS Electronics Inc., Ultromex Limited, Umicore, URT Recycling Technology.
The global e-scrap and printed circuit board (PCB) e-scrap market is segmented on the basis of e-scrap source type, PCB e-scrap type, material recovered (PCB e-scrap). On the basis of e-scrap source type, the market is segmented as household appliances, IT and telecommunication products, entertainment devices. On the basis of PCB e-scrap type, the market is segmented as telecommunications circuit cards, network communications boards, circuit packs, others. On the basis of material recovered (PCB e-scrap), the market is segmented as ferrous components, metals, precious metals
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides overview and forecast of the global E-Scrap and Printed Circuit Board (PCB) E-Scrap market based on type, technology and application. It also provides market size and forecast till 2027 for overall E-Scrap and Printed Circuit Board (PCB) E-Scrap market with respect to five major regions, namely; North America, Europe, Asia Pacific (APAC), Middle East and Africa (MEA) and South America (SAM). The market by each region is later sub-segmented by respective countries and segments. The report covers analysis and forecast of 15 counties globally along with current trend and opportunities prevailing in the region.
Chapter Details of E-Scrap and Printed Circuit Board (PCB) E-Scrap Market:
Part 01: Executive Summary
Part 02: Scope of The Report
Part 03: E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Landscape
Part 04: E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Sizing
Part 05: E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Segmentation by Product
Part 06: Five Forces Analysis
Part 07: Customer Landscape
Part 08: Geographic Landscape
Part 09: Decision Framework
Part 10: Drivers and Challenges
Part 11: Market Trends
Part 12: Vendor Landscape
Part 13: Vendor Analysis
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Answers that the report acknowledges:
• Market size and growth rate during forecast period.
• Key factors driving the E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
• Key market trends cracking up the growth of the E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
• Challenges to market growth.
• Key vendors of E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
• Detailed SWOT analysis.
• Opportunities and threats faces by the existing vendors in Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
• Trending factors influencing the market in the geographical regions.
• Strategic initiatives focusing the leading vendors.
• PEST analysis of the market in the five major region
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