Semiconductor Wafer Polishing and Grinding Equipment Market 2020 Precise Outlook - Applied Materials Inc., Ebara Corporation, Lapmaster Wolters GmbH, Logitech Ltd.

The Semiconductor Wafer Polishing and Grinding Equipment market report is the most important research for who looks for complete information on the Semiconductor Wafer Polishing and Grinding Equipment market. The report covers all information on the global and regional markets including historic and future trends for market demand, size, trading, supply, competitors, and prices as well as global predominant vendor’s information. The forecast market information, SWOT analysis, Semiconductor Wafer Polishing and Grinding Equipment market scenario, and feasibility study are the vital aspects analyzed in this report.

The semiconductor wafer polishing and grinding equipment market was valued at USD 355.54 million in 2019, and it is expected to reach 452.57million by 2025, registering a CAGR of 4.1% during the forecast period (2020 - 2025).

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Top Leading Companies of Global Semiconductor Wafer Polishing and Grinding Equipment Market are Applied Materials Inc., Ebara Corporation, Lapmaster Wolters GmbH, Logitech Ltd., Entrepix Inc., Revasum Inc., Tokyo Seimitsu Co. Ltd. (Accretech Create Corp.), Logomatic GmbH, Disco Corporation, Komatsu NTC Ltd., Okamoto Corporation and others.

Latest Industry News:

- December 2018 - Disco Corporation developed DFG8640, a fully automatic grinder compatible with 8-inch wafers, which is able to grind a wide variety of materials, including Si (silicon), LiTaO3 (LT/lithium tantalate), LiNbO3 (LN/lithium niobate), and SiC (silicon carbide).
- November 2018 - Applied Ventures, LLC, the venture capital arm of Applied Materials, Inc., announced a new co-investment initiative with Empire State Development (ESD), New York State’s economic development organization, aimed at accelerating innovation in Upstate New York. The goal of the initiative is to invest in promising Upstate New York startups across a broad range of established and emerging industries including semiconductors, artificial intelligence, advanced optics, autonomous vehicles, life sciences, clean energy and more.

Key Market Trends

North America to Hold Significant Share

- The region is likely to remain one of the major revenue contributors to the market studied, over the forecast period, as fabless companies (indirect), integrated device manufacturers, and foundries are increasing several activities for semiconductor wafer manufacturers.
- For instance, five leading firms formed the U.S based consortium to pursue the transition to 450 mm wafers. The consortium includes some major firms such as Intel, IBM, Taiwan Semiconductor Manufacturing Company, SAMSUNG, and Global Foundries. This consortium focuses on developing and manufacturing the required equipment to process 450 mm wafers. The increase in wafer sizes will be one of the key trends which will gain traction in the semiconductor wafer polishing and grinding equipment market over the forecast period.
- The technological advancements in consumer electronic devices, such as smartphones and tablets, and the development of smart home devices and wearables in the region are driving the need for small integrated circuits. This, in turn, is fueling the demand for wafer polishing and grinding equipment.

Asia-Pacific to Witness Highest Growth

- Asia-Pacific offers a wide range of opportunities to the market’s growth, compared to other parts of the world. The market in the region witnessed high demand from Outsourced Semiconductor Assembly and Test (OSAT), owing to increasing consolidation in the fab market.
- Many market players are consolidating to withstand the ongoing wave of vertical integration. In countries like China, the government policies that boost the semiconductor industry are increasingly creating opportunities for expansion for the semiconductor materials industry, which is, in turn, boosting the growth of the market.
- For instance, the policy framework released by the State Council of the People’s Republic of China aimed to make advanced semiconductor manufacturing solutions, a technology-priority across the semiconductor industry.

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Crucial Elements from the Table of Contents of Global Semiconductor Wafer Polishing and Grinding Equipment Market:

- Semiconductor Wafer Polishing and Grinding Equipment Market Overview
- Global Semiconductor Wafer Polishing and Grinding Equipment Market Competition, Profiles/Analysis, Strategies
- Global Semiconductor Wafer Polishing and Grinding Equipment Capacity, Production, Revenue (Value) by Region (2015-2020)
- Global Semiconductor Wafer Polishing and Grinding Equipment Supply (Production), Consumption, Export, Import by Region (2015-2020)
- Global Semiconductor Wafer Polishing and Grinding Equipment Market Regional Highlights
- Industrial Chain, Sourcing Strategy, and Downstream Buyers
- Marketing Strategy Analysis, Distributors/Traders
- Market Effect Factors Analysis
- Market Decisions for the present scenario
- Global Semiconductor Wafer Polishing and Grinding Equipment Market Forecast (2020-2025)
- Case Studies
- Research Findings and Conclusion

The research includes historic data from 2015 to 2020 and forecasts until 2025 which makes the report an invaluable resource for industry executives, marketing, sales, and product managers, consultants, analysts, and stakeholders looking for key industry data in readily accessible documents with clearly presented tables and graphs.

Finally, the Semiconductor Wafer Polishing and Grinding Equipment Market report is the believable source for gaining the market research that will exponentially accelerate your business. The report gives the principle locale, economic situations with the item value, benefit, limit, generation, supply, request, and market development rate and figure, and so on. The Semiconductor Wafer Polishing and Grinding Equipment industry report additionally presents a new task SWOT examination, speculation attainability investigation, and venture return investigation.

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