Ball Bonder Machine Market: Understanding the Key Product Segments and their Future 2020 – 2030

Ball Bonder Machine: Introduction

Ball bonder machine is a machine used to enable interconnection between ICs (Integrated Circuits) or any semiconductor device at the time of chip packaging. The connection is established using a thin wire which is generally made of copper, aluminum, gold, or silver. This connection is established through the ball bonding process, which uses a combination of pressure, heat, and ultrasonic energy to make a weld at each end of the wire and chip.

Ball bonder machines are used in various applications across various end-user segments such as Outsourced Semiconductor Assembly and Testing (OSATs) and Integrated Device Manufacturers (IDMs).

The global ball bonder machine market is projected to expand at a rapid pace during the forecast period, due to increasing demand for ball bonder machines from end-users.
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Global Ball Bonder Machine Market: Key Drivers
Rise in development of new electronic products such as smartphones with improved functionality and new standards, is expected to boost the ball bonder machine market during the forecast period.

Shift from manual ball bonder machines to automated ball bonder machines by end-users is anticipated to propel the ball bonder machine market in the next few years.

Rising demand for electronic products among consumers generates demand for chips, which is indirectly expected to increase the demand for ball bonder machines during the forecast period.

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Stringent government regulations regarding workplace safety is also anticipated to boost the demand for ball bonder machines in end-use industries during the forecast period
The advent of new packaging technologies such as through-silicon via (TSV) packaging, and microelectromechanical systems (MEMs) packaging, is expected to boost the demand for ball bonder machines in the forthcoming years.
Increasing use of 3D chip packaging is one of the major factors projected to boost the global ball bonder machine market in the near future.
High cost of ball bonder machines and complexity of the production process is a major factor hamper the usage of ball bonder machines, and this factor is estimated to hinder the market during the forecast period.

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This release was published on openPR.