Die Bonder Equipment Market worth USD 972 Million by 2024 | Global Forecast, Trends, Opportunity and Industry Analysis

According to Market Study Report, Die Bonder Equipment Market provides a comprehensive analysis of the Die Bonder Equipment Market segments, including their dynamics, size, growth, regulatory requirements, competitive landscape, and emerging opportunities of global industry.

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The Global Die Bonder Equipment Market size is projected to grow from USD 820 Million in 2019 to USD 972 Million by 2024, at a CAGR of 3.5% from 2019 to 2024. This report spread across 161 Pages, Profiling 10 Companies and Supported with 110 Tables and 61 figures are now available in this research.

Top Key Players Profiled in the Die Bonder Equipment Market:
• BE Semiconductor Industries N.V.
• ASM Pacific Technology Ltd.
• Kulicke & Soffa
• Mycronic AB
• Palomar Technologies, Inc.
• West•Bond, Inc.
• MicroAssembly Technologies, Ltd.
• Finetech GmbH & Co. KG
• Dr. Tresky AG
• Smart Equipment Technology

Among different types, fully automatic die bonders are projected to lead the market from 2019 to 2024.Fully automatic die bonders can work on different modules, such as wire bonding, wedge bonding, flip chip bonding, and die bonding. Fully automatic die bonders are required for the assembly and packaging of the high volume of consumer products.

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Among bonding techniques, the eutectic bonding technique is projected to witness the highest CAGR in the die bonder equipment market from 2019 to 2024. This technique requires higher operating temperature during the bonding process, and the bond created is not only robust but can also remain intact even in harsh environments.

Among applications, the consumer electronics segment is projected to lead the die bonder equipment market from 2019 to 2024.The largest market size is due to the high demand for miniaturized consumer electronic products such as smart phones, wearables, and white goods that provide advantages such as compactness and durability

Breakdown of primary participants’ profile:
• By Company: Tier 1 =45%, Tier 2 =35%, and Tier 3 =20%
• By Designation: C-level Executives = 35%, Managers = 43%, and Others (Managers, Scientists, and University Researchers) =22%
• By Region: APAC=38%, Americas=37%, and EMEA=25%

Competitive Landscape of Die Bonder Equipment Market:
1 Introduction
2 Market Ranking Analysis, 2018
3 Competitive Scenario
3.1 Product Launches
3.2 Partnerships, Collaborations, Contracts and Agreements
3.3 Acquisitions
3.4 Expansions
4 Competitive Leadership Mapping
4.1 Visionary Leaders
4.2 Dynamic Differentiators
4.3 Innovators
4.4 Emerging Companies
5 Strength of Product Portfolio
6 Business Strategy Excellence

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Research coverage:
This report offers detailed insights into the die bonder equipment market based on type, bonding technique, supply chain participant, device, application, and region. Based on type, the die bonder equipment industry has been segmented into manual, semiautomatic, and fully automatic die bonders.

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