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Semiconductor Assembly and Testing Services Market Analysis and Forecast 2020: By Keyplayers ASE Group, Powertech Technology Inc., Global Foundries Inc., Amkor Technology Inc., CORWIL Technology Corp., Integrated Microelectronics Inc. (Psi Technologies In

08-11-2020 08:57 AM CET | Industry, Real Estate & Construction

Press release from: Coherent Market Insights

Semiconductor Assembly and Testing Service

Semiconductor Assembly and Testing Service

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Market Overview

Semiconductors are special type of material that have value conductivity between a conductor and an insulator. Contrary to metals, a semiconductor material’s resistance falls as its temperature increases. Semiconductor industry is highly volatile in nature. Major companies emphasize designing and utilization of their expertise to enhance performance of ICs or chipsets. Hence, most of the semiconductor assembly, packaging, and testing related services are outsourced by fabless companies to third party providers also called Outsourced Semiconductor Assembly and Test Service Provider.

The global semiconductor assembly and testing services market was valued for US$ 35,772.8 Mn in 2019.

Competitive Section

Key companies operating in the global semiconductor assembly and testing services market are ASE Group, Powertech Technology Inc., Global Foundries Inc., Amkor Technology Inc., CORWIL Technology Corp., Integrated Microelectronics Inc. (Psi Technologies Inc.), STATS chipPAC Ltd. (JCET), Chipbond Technology Corporation, and Silicon Precision Industries Company Ltd.

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Market Dynamics- Drivers

1. Increasing demand for mobility and connectivity in consumer electronic products is expected to drive growth of the global semiconductor assembly and testing services market during the forecast period

Growing requirement for connected and mobile devices namely tablets and smartphones has increased the demand for high-end packaging techniques. Furthermore, increasing demand for digital content has supported growth of home electronic products such as Wi-Fi chipsets and other semiconductor chips. For instance, in 2014, STATS chipPAC (JCET) launched encapsulated Wafer Level Chip Scale Package (eWLCSP) that provides augmented quality and a lower cost fan-in wafer level package for space constrained mobile devices. Moreover, increasing mobility and connectivity capabilities and growing digital content is expected to boost the global semiconductor assembly and testing services market growth during the forecast period.

2. Additional features offered by SATS providers over in-house testing and packaging capabilities are expected to propel the global semiconductor assembly and testing services market growth over the forecast period

SATS providers have extended capabilities of offering additional features namely miniaturization, additional functionality, low power consumption, and improved thermal and electrical performance. This aids OSTAS providers to gain competitive advantage over Integrated Design Manufacturers (IDM) in-house testing capabilities. Moreover, increase in the semiconductor content within electronic products is expected provide better functionality and higher levels of performance. Hence, these factors are expected to support the global semiconductor assembly and testing services market growth in the near future.

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Market Opportunities

1. Investments in advanced packaging solution to pose lucrative business opportunities

SATS providers are focused on increasing capacity utilization rates by expanding existing capabilities. Leading SATS providers are leveraging advanced packaging and test capabilities to create reasonably quick returns on investments made consumers seeking leading edge technologies. These organizations are also focused on advanced packaging technologies as well as a second wave of consumers who still prefer conventional packaging technologies, in order to fulfil capacity in case leading edge customers transition to newer packaging and test equipment and platforms. For instance, in 2013 and 2014, STATchiPAC Inc. invested US$ 46.4 Mn and US$ 39.2 Mn respectively in R&D activities for improving its packaging solutions. This aided the company to increase its revenue from advanced packaging solutions by 1% from 2013, to account for 47.9% in 2014.

2. High capacity utilization rates is expected to present lucrative business opportunities
SATS providers are focused on increasing capacity utilization rates by expanding existing capabilities. Any fluctuation in capacity utilization rates can significantly affect gross margins since the cost per unit usually decreases as fixed costs are distributed over a larger number of units. For instance, in November 2013, CORWIL Technology Corporation expanded its wafer thinning services by adding a Disco DAG 810 automatic grinder. It enhanced the company’s offerings by providing 300 mm wafer backgrinding to its current thinning core capabilities.

Market Trends

1. Growing focus on mergers and acquisitions
Key companies in the market are focused on mergers and acquisitions, in order to gain competitive advantage in the market. For instance, in July 2015, GLOBALFOUNDRIES Inc. acquired IBM’s ‘Microelectronics’ business, which strengthened the company’s workforce by adding experience and expertise in semiconductor development, device expertise, design, and manufacturing. Furthermore, in March 2014, CORWIL Technology Corporation acquired the assets of VIKO Test Labs, a section of Infiniti Solutions. The addition of electrical, environmental, and mechanical test services enhanced CORWIL‘s market position as a provider for both assembly and testing services in the U.S.  

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2. Product innovation through technological advancements is a major trend in the market
Key participants in the market are constantly involved in product development and launching, in order to expand their product portfolio and enhance market presence. For instance, in June 2015, GLOBALFOUNDRIES Inc. developed new digital design flows for Register-transfer Level (RTL) to Graphic Design Database System (GDS) implementation in collaboration with Mentor Graphics, Cadence Design Systems Inc., and Synopsys Inc. Furthermore, in 2013, CORWIL Technology introduced a new FICO MMS-W Molding system. This addition, along with the introduction of the ASM extreme wire bonder, strengthened company’s capability for fine pitch and high density packaging for BGA, QFN, and CSP products.

Key Developments

1. Key companies in the market are focused on mergers and acquisitions, in order to gain competitive edge in the market. For instance, in April 2019, ON Semiconductor acquired Global Foundries Inc. for US$ 430 million.

2. Major market players are involved in mergers and acquisitions, in order to enhance their market presence. For instance, in May 2017, Amkor Technology Inc. acquired Nanium S.A, a semiconductor packaging firm.

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Coherent Market Insights
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Tel: +1-206-701-6702
Email: sales@coherentmarketinsights.com

About Coherent Market Insights:
Coherent Market Insights is a prominent market research and consulting firm offering action-ready syndicated research reports, custom market analysis, consulting services, and competitive analysis through various recommendations related to emerging market trends, technologies, and potential absolute dollar opportunity.

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