High-Density Interconnect (HDI) Printed Circuit Board (PCB) Market is Expected to Reach USD 15,600.6 Million | Key Market Companies are Epec, LLC (US), TTM Technologies (US), PCBCART (China), RAYMING (China) and Mistral Solutions Pvt. Ltd. (India)

High Density Interconnect PCB Market Research Report- Forecast till 2023

Market Highlights

High Density Interconnect (HDI) Printed Circuit Board (PCB) are the higher circuitry density traditional PCB that allows the designers to place more components. The small size of components and the shorter distance between the electronic components that help in reducing the signal loss and for crossing delays that results in the transmission of signals from one part to the other. The increasing need for smaller, energy-efficient and high-performance PCBs has increased for the past many years.

The High Density Interconnect (HDI) PCB has been helpful in the electronic industry for producing lighter, faster, and smaller products. The smartphones have experienced tremendous innovations, ranging from simple monochromic displays and basic voice call features to the computing devices with HD screens, GPS, fast internet connectivity among others. But there is a high cost associated with manufacturing and lack of expertise that is slightly hampering the growth of the global market.

The global High Density Interconnect (HDI) PCB market report presents the market growth from USD 8,683.9 million in the year 2018 to USD 15,600.6 million by the year 2023 at a growing CAGR of 12.4% during the forecast period from 2018 to 2023. The consumer electronics industry is a great contributor in the HDI PCB market owing to the wide adoption of PCBs in computing and smartphone market.

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Segmentation:

The global high density interconnect PCB market report presents the segmentation based on the number of layers and industry vertical. On the basis number of high density interconnection layer, the global market can be split into:



1
2
All


And on the basis of industry verticals, the global high density interconnect PCB market can be divided into:



Military and defense
Consumer electronics
Automotive
Telecom and IT
Medical devices
Others


The report shows the market scenario and overall market size of the global market owing to the increasing digitalization of cars and various advancements towards autonomous and connected cars. The report shows the demand and supply PCBs in the electronics sector of the global market.

Regional Analysis

The North American region is dominating the HDI PCB market during the aforementioned forecast period. It is considered as one of the most advanced regions in terms of development and the adoption of innovative technologies in various semiconductors. This region has a tremendous growth rate that has a huge potential for revenue generation in the PCB market, mostly from automotive and consumer electronics industry verticals. The US is also a dominating market that is growing at a faster rate and will grow more in the coming years. China, Japan and India are the leading countries in the Asia-Pacificc region based on the market share and is expected to continue upwards.

Industry news

Aurora Circuits, a PCB manufacturing company, will be producing circuit boards for ventilator manufacturers, free of cost. The company will be starting the PCB acquisition process for cost shipping only. It is a way of providing the critical components as cost effectively as possible that has opened up capacity at the facility that is making it a priority for controlling a COVID-19 pandemic outbreak.

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High Density Interconnect PCB Market Research Report, By Number of Number of High-Density Interconnection Layer (1, 2 or more, all), Industry Vertical (consumer electronics, military and defense, telecom and IT, automotive) — Global Forecast till 2023

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This release was published on openPR.