Substrate-Like-PCB Market Insights Shared in Detailed Report 2020 to 2025 | Kinsus Interconnect Technology Corp., Ibiden Co.Ltd., Compeq Manufacturing Co. Ltd., Daeduck Electronics Co. Ltd

The substrate-like-PCB market is expected to grow at a CAGR of 12% during the forecast period (2020 - 2025). Owing to the rising adoption of substrate-like-PCB in OEMs, smart consumer electronics and wearable devices, there is a growth of the substrate-like-PCB market. The need for miniaturization and efficient interconnect solutions is also contributing to substrate-like PCB market growth. At present market is heavily dependent on high-end smartphone growth. For instance, Huawei started to produce substrate-like-PCB for the Premium phone P30 Pro released in March 2019.

Substrate-like-PCB (SLP) is a term that describes the transition of a PCB board into a product with package substrate like features. Substrate-like-PCB utilize thin conductors/interconnectors which efficiently transfers signal and power to all connected components and reduces power consumption. Moreover, substrate-like-PCB are more effective in circuit protection and heat dissipation. Substrate-like-PCB has reached line and space that is smaller than 30/30 mm, and substrate-like-PCB is a PCB that has the feature sizes close to that of an IC substrate. Substrate-like-PCB uses additive etch process and has many applications.

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The Global Substrate-Like-PCB market report chiefly includes following manufacturers-

Kinsus Interconnect Technology Corp., Ibiden Co.Ltd., Compeq Manufacturing Co. Ltd., Daeduck Electronics Co. Ltd., Unimicron Technology Corporation, Zhen Ding Technology, TTM Technologies, Meiko Electronics, AT&S, Korea Circuit, Samsung Electro-Mechanics

Global Substrate-Like-PCB Market Scenario-

Consumer Electronics to Augment the Market Growth

- Consumer electronics include smartphones, tablets, smart bands, fitness bands, wearables, and others. Increasing demand for consumer electronics expected to provide opportunities to players in the substrate-like-PCB market.

- With the use of substrate-like-PCB, there will be more space for the battery in a smartphone as substrate-like-PCB will allow for thinner connections between critical components such as the DRAM, NAND flash memory, and application processor. With the use of substrate-like-PCB, the number of layers can be increased, reducing the width and board area by 30% compared to the existing one.

- Moreover, in the next five-year smartphone market across the world will burgeon due to the adaption of smartphone and penetration of the internet. This will increase the growth of the substrate-like-PCB market. The smartphone manufacturers are miniaturizing the devices such that devices become portable and easier to handle. However, the demand for the miniaturization of packages and the growth of IoT will drive the need for substrate-like-PCB modules across the globe.

Major Highlights of Substrate-Like-PCB Market report:

-Substrate-Like-PCB Market Overview

-Market Competition by Manufacturers

-Industrial Chain, Sourcing Strategy and Downstream Buyers

-Marketing Strategy Analysis, Distributors/Traders

-Market Effect Factors Analysis

-Global Substrate-Like-PCB Market Forecast (2020-2026)

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Competitive Landscape

The substrate-like-PCB market is consolidated because the majority of the market share is owned by top players in the industry. Some of the key players include Kinsus Interconnect Technology Corp., Ibiden Co.Ltd., Compeq Manufacturing Co. Ltd., Daeduck Electronics Co. Ltd., Unimicron Technology Corporation, Zhen Ding Technology, Meiko Electronics, TTM Technologies, AT&S, among others.

- June 2019 - TTM Technologies, Inc., a leading global printed circuit board and radio frequency components manufacturer, announced that it will acquire certain manufacturing and intellectual property assets from i3 Electronics, Inc. in order to strengthen its advanced technology PCB capabilities and IP portfolio for emerging applications in the aerospace and defense end market and high-end commercial customers. The acquired technology is an alternative approach to achieve similar lines and spacing as the modified semi-additive process (mSAP) that TTM technologies utilize in their mobility business.

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