3D Semiconductor Packaging Market Growth Strategies by Industry Giants- Amkor Technology, ASE group, Siliconware Precision Industries, Jiangsu Changjiang Electronics, IBM, Intel Corp, Qualcomm

3D Semiconductor Packaging Market Report, published by Allied Market Research, forecasts that the global market is expected to garner $8.9 billion by 2022, registering a CAGR of 15.7% during the forecast period. In the year 2015, Asia-Pacific dominated the global market and contributed over 50% of the overall market and its anticipated to continue this trend during the forecast period.

The global 3D semiconductor packaging industry is witnessing a high-paced growth due to the need to control chip designing cost, which plays a major role in overall price of electronic devices, increase in demand for miniaturized circuits, and short replacement period of electronics products, which are primarily constituted of integrated circuits manufactured with 3D packaging technology.

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Potential Benefits For Stakeholders:

1. This report provides an in-depth analysis of the global 3D semiconductor packaging market along with current 3D semiconductor packaging market trends and future estimations to identify lucrative investment opportunities

2. This report identifies the key drivers, opportunities, and restraints that shape the market along with their impact analysis

3. Porter's Five Forces analysis highlights the potency of buyers and suppliers that participate in this market to facilitate better business decisions for stakeholders and strengthen their supplier and buyer networks

4. Market estimation of geographical regions is based on the current market scenario and future trends

The compact size and enhanced efficiency of 3D semiconductor packaged chips are key factors that drives the 3D semiconductor packaging market. The 3D semiconductor packaging industry in China is witnessing a fast-paced growth as the companies and the government of the country are investing heavily in advanced packaging technology (i.e. 3D semiconductor packaging) lead in the semiconductor industry.

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Impending need of circuit miniaturization to fulfil the increased demand for portable electronics products across the globe and enhanced efficiency demand are some of the key factors that are expected to fuel the growth of the global 3D semiconductor packaging industry in coming years. 3D semiconductor packaging technologies such as 3D wire bonded and 3D TSVs are widely used in advanced 3D packaging design. In the year 2015, wire bonded segment held a significant share of about 44% in the overall 3D semiconductor packaging market revenue. Owing to low cost, easy availability and decent efficiency, the wire bonded technology is anticipated to hold the largest share of overall 3D semiconductor packaging market size.

Asia-Pacific is the most potential region for the manufacturers to increase their revenue and market share in the global 3D semiconductor packaging industry. Increased demand for miniaturize portable devices globally and reduction in power consumption of high-performance devices such as computers, smartphones, and others is observed to be a rising trend in this industry which will supplement the growth and increase the overall 3D semiconductor packaging market size.

Key players such as ASE group, Siliconware Precision Industries Co., Ltd., and Jiangsu Changjiang Electronics Technology Co. Ltd. are largely engaged in the process of product innovation, collaboration, and acquisition to further expand their services across various geographies.

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EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

CHAPTER 3 MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top Impacting Factors

3.2.1.1. Increase in number of portable electronic devices
3.2.1.2. Rise in demand for miniaturized circuits in microelectronic devices
3.2.1.3. Technological superiorities over 2D packaging technology
3.2.1.4. High initial capital investment required to set up a plant works as a restraining factor
3.2.1.5. Thermal issues with devices restrains the growth in the market

3.2.2. Top winning strategies
3.2.3. Top investment pockets

3.3. PORTERS FIVE FORCES ANALYSIS

3.3.1. Bargaining power of suppliers
3.3.2. Bargaining power of buyers
3.3.3. Threat of substitutes
3.3.4. Threat of new entrants
3.3.5. Intensity of competitive rivalry

3.4. MARKET SHARE ANALYSIS, 2015
3.5. 3D SEMICONDUCTOR PACKAGING MARKET: VALUE CHAIN ANALYSIS
3.6. MARKET DYNAMICS

3.6.1. Drivers

3.6.1.1. Increase in number of portable electronic devices
3.6.1.2. Rise in demand of miniaturized circuits in microelectronic devices
3.6.1.3. Technological superiorities over 2D packaging technology

3.6.2. Restraint

3.6.2.1. High initial capital investment required to set up a plant
3.6.2.2. Thermal issues with devices

3.6.3. Opportunities

3.6.3.1. Growing trend of Internet of Things (IoT)

CHAPTER 4 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY

4.1. OVERVIEW

4.1.1. Market size and forecast

4.2. 3D THROUGH SILICON VIA (TSV)

4.2.1. Key market trends
4.2.2. Growth factors and opportunities
4.2.3. Market size and forecast

4.3. 3D PACKAGE ON PACKAGE (POP)

4.3.1. Key market trends
4.3.2. Growth factors and opportunities
4.3.3. Market size and forecast

4.4. 3D FAN OUT

4.4.1. Key market trends
4.4.2. Growth factors and opportunities
4.4.3. Market size and forecast

4.5. 3D WIRE BONDED

4.5.1. Key market trends
4.5.2. Growth factors and opportunities
4.5.3. Market size and forecast

4.6. OTHERS (FLIP CHIP AND HYBRID)

4.6.1. Key market trends
4.6.2. Growth factors and opportunities
4.6.3. Market size and forecast

CHAPTER 5 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY MATERIAL

5.1. OVERVIEW

5.1.1. Market size and forecast

5.2. ORGANIC SUBSTRATE

5.2.1. Key market trends
5.2.2. Growth factors and opportunities
5.2.3. Market size and forecast

5.3. BONDING WIRE

5.3.1. Key market trends
5.3.2. Growth factors and opportunities
5.3.3. Market size and forecast

5.4. LEADFRAME

5.4.1. Key market trends
5.4.2. Growth factors and opportunities
5.4.3. Market size and forecast

5.5. ENCAPSULATION RESIN

5.5.1. Key market trends
5.5.2. Growth factors and opportunities
5.5.3. Market size and forecast

5.6. CERAMIC PACKAGE

5.6.1. Key market trends
5.6.2. Growth factors and opportunities
5.6.3. Market size and forecast

5.7. DIE ATTACH MATERIAL

5.7.1. Key market trends
5.7.2. Growth factors and opportunities
5.7.3. Market size and forecast

5.8. OTHERS

5.8.1. Key market trends
5.8.2. Growth factors and opportunities
5.8.3. Market size and forecast

3D Semiconductor Packaging Market to Reach $8.9 Billion, Globally, by 2022:
http://azizsalon.com/3d-semiconductor-packaging-market-size-is-estimated-to-reach-8-9-billion-by-2022-major-players-are-amkor-technology-siliconware-precision-industries-jiangsu-changjiang-electronics-sss-microtec-a/

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