Press release
Molded Interconnect Devices (MID) Market 2026 | Amphenol T&M Antennas, Galtronics, Harting Mitronics AG, LPKF Laser & Electronics AG, MacDermid Enthone, Molex, Multiple Dimensions AG, RTP Company, S2P smart plastic product, SelectConnect Technologies, Suz
The rising deployment of circuit boards in electro-mechanical applications has been a pivotal contributor toward molded interconnect device market growth. MIDs are essentially injection molded plastic parts that consist of conductive circuit patterns that can be used to perform electrical and mechanical functions. MIDs find extensive applications in many industrial sectors ranging from automotive and medical to consumer electronics.In essence, MIDs are being used to downgrade a number of parts on a single integrated chip that would contribute to space-saving and weight reduction - an essential production parameter in the aforementioned sectors. Additionally, the integration of multi-function technologies for scalability has been remarkably promoting molded interconnect device Market.
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One of the leading suppliers of interconnected devices, Molex has recently developed an innovative MID which could prove to be useful for medical device designers to combine mechanical and electrical features in compact applications. The increasing popularity of molded interconnect devices across the medical industry to address convergence, miniaturization, and application issues is poised to boost MID market size over the years ahead. Driven by the surging adoption of MIDs, molded interconnect device Market size from the healthcare sector will grow at a CAGR of more than 15% over 2018-2024.
The key players operating in the industry include
o Amphenol T&M Antennas
o Galtronics
o Harting Mitronics AG
o LPKF Laser & Electronics AG
o MacDermid Enthone
o Molex
o Multiple Dimensions AG
o RTP Company
o S2P smart plastic product
o SelectConnect Technologies
o Suzhou Cicor Technology Co. Ltd
o TE Connectivity
o Teprosa GmbH
o Tongda Group
o Yomura
o Material Suppliers: BASF
o DSM
o EMS-GRIVORY
o Ensinger GmbH
o Division Ensinger Compounds
o Evonik Industries
o Lanxess
o Mitsubishi Engineering Plastics
o PTS Group
o RTP
o Sinoplast New Material Ltd.
o Zeon Corporation
Molded Interconnect Devices (MID) market is poised to witness an accelerated growth over the ensuing years, amidst the backdrop of the frequent technological advancements in telecommunication sector. The ability of the device to facilitate miniaturization has largely added to the expansion of its application portfolio in a range of consumer products.
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Table Of Content:
Chapter 5 MID Market, By Application
5.1 Key trends by application
5.2 Automotive
5.2.1 Market estimates and forecast, 2015 - 2026
5.2.2 Market estimates and forecast, by process, 2015 - 2026
5.3 Consumer products
5.3.1 Market estimates and forecast, 2015 - 2026
5.3.2 Market estimates and forecast, by process, 2015 - 2026
5.4 Healthcare
5.4.1 Market estimates and forecast, 2015 - 2026
5.4.2 Market estimates and forecast, by process, 2015 - 2026
5.5 Industrial
5.5.1 Market estimates and forecast, 2015 - 2026
5.5.2 Market estimates and forecast, by process, 2015 - 2026
5.6 Military & aerospace
5.6.1 Market estimates and forecast, 2015 - 2026
5.6.2 Market estimates and forecast, by process, 2015 - 2026
5.7 Telecommunication & computing
5.7.1 Market estimates and forecast, 2015 - 2026
5.7.2 Market estimates and forecast, by process, 2015 - 2026
5.8 Others
5.8.1 Market estimates and forecast, 2015 - 2026
5.8.2 Market estimates and forecast, by process, 2015 - 2026
Browse complete Table of Contents (ToC) of this research report @ https://www.decresearch.com/toc/detail/molded-interconnect-devices-MID-market
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