SMT Placement Equipment Market 2020 Analysis By Global Manufacturers - ASM Pacific Technology, Fuji, Hanwha Techwin, Yamaha Motor

The report titled "SMT Placement Equipment Market" report will be very useful to get a stronger and effective business outlook. It provides an in-depth analysis of different attributes of industries such as trends, SWOT analysis, policies, and clients operating in several regions. The qualitative and quantitative analysis techniques have been used by analysts to provide accurate and applicable data to the readers, business owners and industry experts.

The global SMT Placement Equipment market is valued at 4211 million US$ in 2020 is expected to reach 8756.1 million US$ by the end of 2026, growing at a CAGR of 10.9% during 2021-2026.

SMT (surface mount technology) component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB). They are used for high speed, high precision placing of a broad range of electronic components, like capacitors, resistors, integrated circuits onto the PCBs which are in turn used in computers, telecommunications equipment, consumer electronic goods, industrial equipment, medical instruments, automotive systems, military systems and aerospace engineering.

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The report presents the market competitive landscape and a corresponding detailed analysis of the major vendor/key players in the market. Top Companies in the Global SMT Placement Equipment Market: ASM Pacific Technology, Fuji, Hanwha Techwin, Yamaha Motor, JUKI, Panasonic, Assembly(K&S), Mycronic, Universal Instruments, Europlacer, Mirae, Autotronik, DDM Novastar, Beijing Torch, etc. and others.

News Update:

- Shanghai / November 15, 2019, / ASMPT Signed Letters Of Intent Worth Over US$300 Million At CIIE
ASM Pacific Technology Ltd. (ASMPT), the world leader in semiconductor assembly and packaging solutions, equipment and materials, announced that several customers have issued a Letter of Intent (LOI) indicating their intention to purchase semiconductor equipment in the next 12 to 36 months.

- Singapore and Hong Kong / 2 October 2018 / ASMPT Well-Positioned To Leverage High Growth Of Advanced Semiconductor Packaging With NEXX Purchase
ASM Pacific Technology Ltd. (ASMPT), the world leader in semiconductor assembly and packaging equipment, announced that on 1 October 2018 it has completed its acquisition of TEL NEXX, Inc (NEXX) from Tokyo Electron Limited (TEL). TEL NEXX will be subsumed under the Back-End Equipment segment of ASMPT.

Global SMT Placement Equipment Market Split By Product Type and Applications:

This report segments the global SMT Placement Equipment Market on the basis of Types are:
Segment by Type
High-Speed Type
Medium-Speed Type
Others

On the basis of Application, the Global SMT Placement Equipment Market is segmented into:
Consumer Electronics
Medical
Automotive
Telecommunications Equipment
Others

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Regional Analysis For SMT Placement Equipment Market:

For the comprehensive understanding of market dynamics, the global SMT Placement Equipment Market is analysed across key geographies namely: United States, China, Europe, Japan, South-east Asia, India and others. Each of these regions is analysed on the basis of market findings across major countries in these regions for a macro-level understanding of the market.

Important Features that are under Offering and Key Highlights of the Reports:

- Detailed overview of SMT Placement Equipment Market.
- Changing market dynamics of the SMT Placement Equipment Market industry.
- In-depth segmentation of SMT Placement Equipment Market by Type, Application etc.
- Historical, current and projected market size in terms of volume and value.
- Recent industry trends and developments.
- Competitive landscape of SMT Placement Equipment Market.
- Strategies of key players and product offerings.
- Potential and niche segments/regions exhibiting promising growth.

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Reference and Source:

https://www.asmpacific.com/en/media-release/97-asmpt-signed-letters-of-intent-worth-over-us-300-million-at-ciie

https://www.asmpacific.com/en/media-release/85-asmpt-well-positioned-to-leverage-high-growth-of-advanced-semiconductor-packaging-with-nexx-purchase

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