Memory Packaging Market 2020 Business Insights and Global Outlook - Sk Hynix Inc., Cisco Systems Inc., Nanya Technology CorporationGlobal Memory Packaging Market - Growth, Trends, And Forecast (2020 - 2023)
The report presents an in-depth assessment of the Global Memory Packaging including enabling technologies, key trends, market drivers, challenges, standardization, regulatory landscape, deployment models, operator case studies, opportunities, future roadmap, value chain, ecosystem player profiles and strategies. The report also presents forecasts for Global Memory Packaging investments from 2020 till 2023.
Click the link to get a Sample Copy of the Report:
The Global Memory Packaging market is highly competitive and consists of a number of major players. Companies, like Sk Hynix Inc., Cisco Systems Inc., Nanya Technology Corporation., Winbond Electronics Corporation., Micron Technology Inc., Fujitsu Semiconductor Limited., Western Digital Corporation., Samsung Electronics Co. Ltd., Qualcomm Technologies Inc., Stmicroelectronics., Ibm Corporation., Dell Emc., Toshiba Electronic Devices & Storage Corporation., Hana Micron Inc., Apple Inc. And Ase Group among others.
Latest news and developments:
March 5, 2020: SK Hynix has passed one of the hurdles to the launch of a next-generation memory. U.S. semiconductor company Synopsys recently announced that it will provide a memory system on chip (SoC) interface solution based on its packaging technology to SK Hynix for manufacturing of the high bandwidth memory (HBM2E). The SoC meets JEDEC's HBM2E SDRAM standard based on the 7-nm process of TSMC, and has a data rate of 409 GB/sec. It can handle 110 full HD movies (3.7 GB per film) in just one second. SK Hynix was the first company that proposed HBM chips to JEDEC. The chip can simultaneously send power to data through thousands of holes. It can reduce the chip size by more than 30 percent and power consumption by more than 50 percent compared to the current packaging method. HBM chips can be mounted as SoCs that are mounted close to logic chips such as GPUs several tens of micrometers apart. Therefore, they can further reduce data travel distances compared to SoCs mounted on motherboards in parallel.
June 25, 2018: Micron Technology, Inc. (Nasdaq:MU) announced volume production on its 8GB GDDR6 memory. Built on experience and execution for several generations of GDDR memory, GDDR6 - Micron's fastest and most powerful graphics memory designed in Micron's Munich Development Center - is optimized for a variety of applications that require high performance memory, including artificial intelligence (AI), networking, automotive and graphics processing units (GPUs). Additionally, Micron has worked with core ecosystem partners to ramp GDDR6 documentation and interoperability, enabling faster time to market for designs.
Like processors, memory is made from small semiconductor chips and must be packaged into less fragile and smaller chips to be integrated with the rest of the system. There are many different memory device packaging options available, used in a wide range of packaging technologies, ranging from the low pin-count SOP packages to high pin-count TSV options, depending on product requirements, like performance, density, and cost. One such packaging platform is the wire bond-BGA. Easy changeovers, comprehensible program adjustments, and low engineering costs are driving the demand for wire-bond memory packaging solutions. Even with variations in the package design, the wire-bond memory packaging platform is the most the preferred interconnection platform because of its flexibility, reliability, and low cost. Also, the automotive market, which generally uses low density (low-MB) memory, may observe an increase in the acceptance of DRAM memory, led by the emerging trend of autonomous driving and in-vehicle infotainment. This is expected to fuel the growth of the memory packaging market.
Inquire for Discount:
Key Market Trends:
Increase in the Demand for Smartphones
The highest demand for memory can be observed in the smartphones market. On an average, the DRAM memory capacity per smartphone may increase more than threefold to reach around 6GB, by 2022. DRAM cost per smartphone signifies >10% of the bill of materials of the smartphone and is anticipated to increase further. The NAND capacity per smartphone may increase more than fivefold to reach >150GB by 2022. In mobile applications, the focus of memory packaging is expected to be on the wire-bond BGA platform. It may also start to move into the multi-chip package (ePoP) for high-end smartphones.
According to the Consumer Technology Association, in 2013, almost 145 million people in the United States owned a smartphone, and this figure is set to rise to 220 million by 2018. Additionally, the share of smartphones consumers in China was over 53.3% of the total mobile phone users in the country in 2016, which increased to over 56 % in 2017. With the increase in adoption of smartphones, the use of packaged memory chips is also increasing. Also, with the development of memory packaging techniques, the size of smartphones is reduced, which may further augment the demand for the memory packing market
Browse the Full report description and TOC at:
The key insights of the Memory Packaging Market report:
The report provides key statistics on the market status of the Memory Packaging market manufacturers and is a valuable source of guidance and direction for companies and individuals interested in the industry.
The report provides a basic overview of the industry including its definition, applications and manufacturing technology.
The Memory Packaging market report presents the company profile, product specifications, capacity, production value, and 2015-2020 market shares for key vendors.
The total market is further divided by company, by country, and by application/type for the competitive landscape analysis.
The report estimates 2020-2023 market development trends of Memory Packaging Market.
Analysis of upstream raw materials, downstream demand and current market dynamics is also carried out
The report makes some important proposals for a new project of Memory Packaging Industry before evaluating its feasibility.
Finally, Memory Packaging Market report is the believable source for gaining the market research that will exponentially accelerate your business. The report gives the principle locale, economic situations with the item value, benefit, limit, generation, supply, request and market development rate and figure and so on. Memory Packaging industry report additionally Present new task SWOT examination, speculation attainability investigation, and venture return investigation.
Browse Related Reports:
Semiconductor Packaging Market:
Pharmaceutical Blister Packaging Market:
Reasons to Purchase this report:
- The market estimate (ME) sheet in Excel format
- Report customization as per the client's requirements
- 3 months of analyst support
How we have factored the effect of Covid-19 in our report:
All the reports that we list have been tracking the impact of COVID-19. Both upstream and downstream of the entire supply chain has been accounted for while doing this. Also, where possible, we will provide an additional COVID-19 update supplement/report to the report in Q3, please check for with the sales team.
MarketInsightsReports provides syndicated market research on industry verticals including Healthcare, Information and Communication Technology (ICT), Technology and Media, Chemicals, Materials, Energy, Heavy Industry, etc. MarketInsightsReports provides global and regional market intelligence coverage, a 360-degree market view which includes statistical forecasts, competitive landscape, detailed segmentation, key trends, and strategic recommendations.
Media Contact Us:
Irfan Tamboli (Head of Sales) - Market Insights Reports
Phone: + 1704 266 3234 | +91-750-707-8687
This release was published on openPR.
Permanent link to this press release:
Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.
You can edit or delete your press release Memory Packaging Market 2020 Business Insights and Global Outlook - Sk Hynix Inc., Cisco Systems Inc., Nanya Technology Corporation here
News-ID: 2054019 • Views: 587
More Releases from Market Insights Reports
Emerging Trends in Time Interval Meter Market 2023 and Global Foreseen Till 2029 …
The Time Interval Meter Market 2023-2029 is an extensive market research report which provides industry analysis with a historical & futuristic outlook for the following parameters; market size, revenue, demand, and supply data. The report includes comprehensive information on the market drivers, key trends and challenges, a deep examination of technology trends, opportunities, value chains, future roadmaps, and strategies. The report consists of SWOT, PESTEL, and Porter's 5-forces analysis frameworks.
Major Player in the Wind Turbine Automatic Lubrication System Market Witnessing …
The Wind Turbine Automatic Lubrication System market is expected to grow by USD 4.74 billion from 2023 to 2029. The Wind Turbine Automatic Lubrication System Market 2023-2029 is an extensive market research report which provides industry analysis with a historical & futuristic outlook for the following parameters; market size, revenue, demand, and supply data. The report includes comprehensive information on the market drivers, key trends and challenges, a deep examination of
World Leading Companies involved in The Growing Digital Alcohol Tester Market 20 …
The global Digital Alcohol Tester market in terms of revenue was estimated to be worth $530 million in 2023 and is poised to reach $1,467 million by 2029, growing at a CAGR of 20.4% from 2023 to 2029. The Digital Alcohol Tester Market 2023-2029 is an extensive market research report which provides industry analysis with a historical & futuristic outlook for the following parameters; market size, revenue, demand, and supply data.
Unparalleled Research on Wireless Ballbar Market With Current and Future Growth …
The global Wireless Ballbar Market was valued at $31.9 billion in 2021, and is projected to reach $104.8 billion by 2031, growing at a CAGR of 12.9% from 2023 to 2029. The Wireless Ballbar Market 2023-2029 is an extensive market research report which provides industry analysis with a historical & futuristic outlook for the following parameters; market size, revenue, demand, and supply data. The report includes comprehensive information on the market
More Releases for Packaging
Personalized Packaging Market 2019 By Key Players: Owens Illinois, Salazar Packa …
Personalized Packaging Market research report delivers a close watch on leading competitors with strategic analysis, micro and macro market trend and scenarios, pricing analysis and a holistic overview of the market situations in the forecast period. Download PDF Sample of this Report @ http://www.supplydemandmarketresearch.com/home/contact/277379?ref=Sample-and-Brochure&toccode=SDMRCH277379&utm_source=S2 The following manufacturers are covered: Owens Illinois Salazar Packaging Design Packaging PrimeLine Packaging International Packaging Elegant Packaging Pak Factory ABOX Packaging ACG Ecopak CB Group SoOPAK Company Huhtamaki
E-Commerce Packaging Market by Top Key Players - Pioneer Packaging, Arihant pack …
E-commerce packaging involves the use of materials for safe packaging of products sold by the e-commerce industry. E-commerce packaging plays a vital role in the consumers' perception about the e-retailer. It also indicates the perceived value of the item received. Packaging reflects the value of shipment in the e-commerce supply chain, that is, better the packaging, better the product inside it. Get Sample Copy of this Report @ https://www.bigmarketresearch.com/request-sample/2904563 The E-Commerce
Luxury Packaging Market 2019 SWOT Analysis By Top Key Players; MW Luxury Packagi …
Luxury Packaging Market report provides an in-depth overview of product specification, technology, product type and production analysis considering major factors such as revenue, cost, gross and gross margin. The company profiles of all the key players and brands that are dominating the Luxury Packaging Market with moves like product launches, joint ventures, merges and accusations which in turn is affecting the sales, import, export, revenue and CAGR values are mentioned
Global Luxury Packaging Market 2019 Top Key Players: MW Luxury Packaging, Progre …
Summary WiseGuyReports.com adds “Luxury Packaging Market 2019 Global Analysis, Growth, Trends and Opportunities Research Report Forecasting to 2024” reports to its database. This report provides in depth study of “Luxury Packaging Market” using SWOT analysis i.e. Strength, Weakness, Opportunities and Threat to the organization. The Luxury Packaging Market report also provides an in-depth survey of key players in the market which is based on the various objectives of an organization such as
Top Manufacturer in Luxury Packaging Market 2019: MW Luxury Packaging, Progress …
Luxury packaging is used for packaging and decorating high-end products.An increase in the luxury product consumption rate and the number of product launches in the fashion and cosmetic sectors are some major factors driving the market growth. The global Luxury Packaging market is valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025. The objectives
Personalized Packaging Market 2025 | Design Packaging, Inc., PrimeLine Packaging …
As per the new market report published by Research Report Insights titled ‘Personalized Packaging Market’: Global Industry Analysis and Forecast 2017-2025’, global personalized packaging market attained a value worth US$ 25,577.9 Mn in 2017 and will possibly thrive at a promising CAGR of 5.1% over the forecast period (2017-2025). The global personalized packaging market has witnessed solid growth during the past few decades, owing to the increasing trend of luxury