Memory Packaging Market 2020 Business Insights and Global Outlook - Sk Hynix Inc., Cisco Systems Inc., Nanya Technology Corporation

Global Memory Packaging Market - Growth, Trends, And Forecast (2020 - 2023)

The report presents an in-depth assessment of the Global Memory Packaging including enabling technologies, key trends, market drivers, challenges, standardization, regulatory landscape, deployment models, operator case studies, opportunities, future roadmap, value chain, ecosystem player profiles and strategies. The report also presents forecasts for Global Memory Packaging investments from 2020 till 2023.

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The Global Memory Packaging market is highly competitive and consists of a number of major players. Companies, like Sk Hynix Inc., Cisco Systems Inc., Nanya Technology Corporation., Winbond Electronics Corporation., Micron Technology Inc., Fujitsu Semiconductor Limited., Western Digital Corporation., Samsung Electronics Co. Ltd., Qualcomm Technologies Inc., Stmicroelectronics., Ibm Corporation., Dell Emc., Toshiba Electronic Devices & Storage Corporation., Hana Micron Inc., Apple Inc. And Ase Group among others.

Latest news and developments:

March 5, 2020: SK Hynix has passed one of the hurdles to the launch of a next-generation memory. U.S. semiconductor company Synopsys recently announced that it will provide a memory system on chip (SoC) interface solution based on its packaging technology to SK Hynix for manufacturing of the high bandwidth memory (HBM2E). The SoC meets JEDEC's HBM2E SDRAM standard based on the 7-nm process of TSMC, and has a data rate of 409 GB/sec. It can handle 110 full HD movies (3.7 GB per film) in just one second. SK Hynix was the first company that proposed HBM chips to JEDEC. The chip can simultaneously send power to data through thousands of holes. It can reduce the chip size by more than 30 percent and power consumption by more than 50 percent compared to the current packaging method. HBM chips can be mounted as SoCs that are mounted close to logic chips such as GPUs several tens of micrometers apart. Therefore, they can further reduce data travel distances compared to SoCs mounted on motherboards in parallel.

June 25, 2018: Micron Technology, Inc. (Nasdaq:MU) announced volume production on its 8GB GDDR6 memory. Built on experience and execution for several generations of GDDR memory, GDDR6 - Micron's fastest and most powerful graphics memory designed in Micron's Munich Development Center - is optimized for a variety of applications that require high performance memory, including artificial intelligence (AI), networking, automotive and graphics processing units (GPUs). Additionally, Micron has worked with core ecosystem partners to ramp GDDR6 documentation and interoperability, enabling faster time to market for designs.

Like processors, memory is made from small semiconductor chips and must be packaged into less fragile and smaller chips to be integrated with the rest of the system. There are many different memory device packaging options available, used in a wide range of packaging technologies, ranging from the low pin-count SOP packages to high pin-count TSV options, depending on product requirements, like performance, density, and cost. One such packaging platform is the wire bond-BGA. Easy changeovers, comprehensible program adjustments, and low engineering costs are driving the demand for wire-bond memory packaging solutions. Even with variations in the package design, the wire-bond memory packaging platform is the most the preferred interconnection platform because of its flexibility, reliability, and low cost. Also, the automotive market, which generally uses low density (low-MB) memory, may observe an increase in the acceptance of DRAM memory, led by the emerging trend of autonomous driving and in-vehicle infotainment. This is expected to fuel the growth of the memory packaging market.

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Key Market Trends:

Increase in the Demand for Smartphones

The highest demand for memory can be observed in the smartphones market. On an average, the DRAM memory capacity per smartphone may increase more than threefold to reach around 6GB, by 2022. DRAM cost per smartphone signifies >10% of the bill of materials of the smartphone and is anticipated to increase further. The NAND capacity per smartphone may increase more than fivefold to reach >150GB by 2022. In mobile applications, the focus of memory packaging is expected to be on the wire-bond BGA platform. It may also start to move into the multi-chip package (ePoP) for high-end smartphones.

According to the Consumer Technology Association, in 2013, almost 145 million people in the United States owned a smartphone, and this figure is set to rise to 220 million by 2018. Additionally, the share of smartphones consumers in China was over 53.3% of the total mobile phone users in the country in 2016, which increased to over 56 % in 2017. With the increase in adoption of smartphones, the use of packaged memory chips is also increasing. Also, with the development of memory packaging techniques, the size of smartphones is reduced, which may further augment the demand for the memory packing market

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The key insights of the Memory Packaging Market report:
The report provides key statistics on the market status of the Memory Packaging market manufacturers and is a valuable source of guidance and direction for companies and individuals interested in the industry.
The report provides a basic overview of the industry including its definition, applications and manufacturing technology.
The Memory Packaging market report presents the company profile, product specifications, capacity, production value, and 2015-2020 market shares for key vendors.
The total market is further divided by company, by country, and by application/type for the competitive landscape analysis.
The report estimates 2020-2023 market development trends of Memory Packaging Market.
Analysis of upstream raw materials, downstream demand and current market dynamics is also carried out
The report makes some important proposals for a new project of Memory Packaging Industry before evaluating its feasibility.

Finally, Memory Packaging Market report is the believable source for gaining the market research that will exponentially accelerate your business. The report gives the principle locale, economic situations with the item value, benefit, limit, generation, supply, request and market development rate and figure and so on. Memory Packaging industry report additionally Present new task SWOT examination, speculation attainability investigation, and venture return investigation.

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