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Advanced Packaging Market 2020 - Industry Analysis and Business Strategies by Players Like ASE Group, Amkor Technology, SPIL, STATS ChipPAC, Jiangsu Changjiang Electronics, SSS MicroTec AG

04-09-2020 06:08 PM CET | Advertising, Media Consulting, Marketing Research

Press release from: Allied Market Research

Advanced packaging techniques uses an integrated circuit (IC), which is encapsulated in a supporting case that prevents physical damage and corrosion of the metallic parts. This case is called as package that support electrical contacts connected to the device to a circuit board. Advanced packaging manufacturers produce various types of ICs according to the requirements in the packaging. The type of package used depends upon different parameters such as size, power dissipation, field-operating conditions, and its cost.

The global advanced packaging market is driven by its advantages over conventional packaging technologies, imminent requirement for size reduction in electronic devices, and less power consumption. However, the heating problem in devices restrains the market growth. Furthermore, rise in investment of R&D activities and continuous improvement of these technologies provide new opportunities for the players operating in the market.

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The global advanced packaging market is segmented based on type, industry vertical, and geography. Based on type, it is classified into 3D integrated circuit, fan out silicon in package, fan out-wafer lever package, 3D wafer level package, wafer level chip scale package, 2.5D, and flip chip. Based on application, it is divided into consumer electronics, IT & telecommunication industrial, automotive & transport, healthcare, aerospace & defense, and others. Geographically, it is analyzed across North America (U.S., Mexico, and Canada), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, Taiwan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).

The major companies profiled on the report include ASE Group, Amkor Technology, Siliconware Precision Industries Co., Ltd. (SPIL), STATS ChipPAC Pte. Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., SSS MicroTec AG., International Business Machines Corporation (IBM), Intel Corporation, Qualcomm Technologies, Inc., and Taiwan Semiconductor Manufacturing Company.

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Key Benefits:
o The study provides an in-depth analysis of the global advanced packaging market along with current and future trends to elucidate the imminent investment pockets in the market.
o Current and future trends are outlined to determine the overall attractiveness and single out profitable trends to gain a stronger foothold in the market.
o The report provides information related to key drivers, restraints, and opportunities along with the impact analyses.
o Quantitative analysis of the current market and estimations from 2020 to 2027 is provided determine the financial potential of the market.
o Porters Five Forces model and SWOT analysis of the industry illustrate the potency of the buyers & suppliers participating in the market.
o Value chain analysis provided a clear understanding of the roles of stakeholders.

Advanced Packaging Market Key Segments:
By Type
o 3D Integrated Circuit
o 2D Integrated Circuit
o 2.5D Integrated Circuit
o Fan Out Silicon in Package
o Fan Out Wafer Lever Package
o Wafer Level Chip Scale Package
o Flip Chip
o Others

By Industry Vertical
o Consumer Electronics
o IT & Telecommunication
o Industrial
o Automotive & Transport
o Healthcare
o Aerospace & Defense
o Others

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Key Players:
o ASE Group
o Amkor Technology
o Siliconware Precision Industries Co., Ltd. (SPIL)
o STATS ChipPAC Pte. Ltd.
o Jiangsu Changjiang Electronics Technology Co. Ltd.
o SSS MicroTec AG.
o International Business Machines Corporation (IBM)
o Intel Corporation
o Qualcomm Technologies, Inc.
o Taiwan Semiconductor Manufacturing Company

About Us

Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Portland, Oregon. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of "Market Research Reports" and "Business Intelligence Solutions." AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.

We are in professional corporate relations with various companies and this helps us in digging out market data that helps us generate accurate research data tables and confirms utmost accuracy in our market forecasting. Each and every data presented in the reports published by us is extracted through primary interviews with top officials from leading companies of domain concerned. Our secondary data procurement methodology includes deep online and offline research and discussion with knowledgeable professionals and analysts in the industry.

Contact:
David Correa
5933 NE Win Sivers Drive
#205, Portland, OR 97220
United States
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+1-800-792-5285, +1-503-894-6022, +1-503-446-1141
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Fax: +1(855)550-5975
help@alliedmarketresearch.com
Web: https://www.alliedmarketresearch.com

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