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3D XPoint Market 2020 - Industry Analysis and Business Strategies by Players Like IM Flash, Intel Corporation, Micron Technology, Samsung Group, Toshiba, Mushkin Inc.

04-09-2020 06:03 PM CET | IT, New Media & Software

Press release from: Allied Market Research

The market trend of high requirement of miniaturized version of storage devices is the reason behind the development of the 3D XPoint (pronounced as 3D cross point) technology. The way 3D XPoint works is fundamentally very different from that of NAND gate. Whereas NAND defines bit values by trapping a varying number of electrons in an insulated floating gate, 3D XPoint is a resistance-based technology that works by a bulk property change to alter the resistance level of a cell and thus differentiate between a 0 and 1 (the binary codes or the digital codes).

The 3D XPoint structure is very simple. It consists of a selector and memory cell, which sit in between a word-line and bit-line (hence the "cross-point" name). Applying a specific voltage on the word-line and bit-line will activate a single selector and enable the cell underneath to be either written or read.

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The main factors such as increased durability, great performance, large capacity storage, and high speed are the major reasons for the growth of the 3D XPoint market. Also, its low cost as compared to the present non-volatile storage devices is an important aspect that plays a major role behind its growth in the market. However, interface limitation is one of the major restraints in the path of the growth of the market.

The market for 3D XPoint is segmented into storage type, end user, and geography. The storage type is classified as 750 GB and 1.5 TB, and others. The end user is categorized into telecommunication, consumer electronics, automotive, healthcare, retail, and others. By geography, it is studied across North-America, Asia-Pacific, Europe, and LAMEA. The key players as mentioned in the report are IM Flash, Intel Corporation, Micron Technology, Inc., Numonyx B.V., Samsung Group, SK Hynix, Inc., Toshiba Corp., Western Digital Corp., and Mushkin Inc.

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Key Benefits:
o This report provides an extensive analysis of the current and emerging market trends, dynamics, and estimations for the key market segments in the global 3D XPoint market from 2020 to 2027.
o Exhaustive analysis of the market by storage type and end user helps understand the instruments that are currently used and the variants that are expected to gain prominence in the future.
o This report presents competitive intelligence of the market to understand the competitive scenario across the countries globally.

3D XPoint Market Key Segmentation:
By Storage Type
o 750 GB
o 1.5 TB
o Others

By End User
o Telecommunication
o Consumer Electronics
o Automotive
o Healthcare
o Retail
o Others

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Key Players
o IM Flash
o Intel Corporation.
o Micron Technology, Inc.
o Numonyx B.V.
o Samsung Group.
o Sandisk Corporation.
o SK Hynix, Inc.
o Toshiba Corp.
o Western Digital Corp.
o Mushkin Inc

About Us

Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Portland, Oregon. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of "Market Research Reports" and "Business Intelligence Solutions." AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.

We are in professional corporate relations with various companies and this helps us in digging out market data that helps us generate accurate research data tables and confirms utmost accuracy in our market forecasting. Each and every data presented in the reports published by us is extracted through primary interviews with top officials from leading companies of domain concerned. Our secondary data procurement methodology includes deep online and offline research and discussion with knowledgeable professionals and analysts in the industry.

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