How Trade War between U.S.-China has Impacted the Semiconductor Capital Equipment Market? Major Players are: Applied Materials, Inc., Concurrent Design, Inc., EV Group, ASML Holding, Hitachi High-Technologies

Semiconductor capital equipment industry comprises of manufacturers and market machines, which are involved in the production of electronic devices.

The innovation and growth in use of portable digital devices such as smart wearable, display panels, smartphones, and tablets influence the semiconductor capital equipment market.

The factors including innovation and development of smart and portable devices, increase in digitalization in various industrial verticals and application of IoT in the digital electronic devices drives the growth for Semiconductor Capital Equipment Market.

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Further, the use of technologies like AI-machine learning, IoT in the manufacturing of semiconductor devices and components which uses robotics arms and digitally fed data to operate and process wafers on the assembly line. The technological growth boosts the semiconductor capital equipment market growth.

In addition, the high initial cost of setup and installation due to limited manufacturers of manufacturing machines and setup impact the market of semiconductor capital equipment negatively. Further, the trade war between U.S.-China has impacted the semiconductor industry. In future, the construction of smart cities would require smart sensors, smart display panel devices and various other digital electronics which would boost the semiconductor capital equipment market growth.

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The key players covered in the semiconductor capital equipment industry are Applied Materials, Inc., Concurrent Design, Inc., EV Group, ASML Holding, Hitachi High-Technologies, Lam Research Corporation, Tokyo Electron Limited, Advantest, AMEC, and ACCRETECH - Tokyo Seimitsu .

The semiconductor capital equipment market is segmented on the basis of type, application, industrial vertical, and region.

On the basis of type, it is classified into assembly equipment, automated test equipment, and wafer level manufacturing equipment. On the basis of application, it is divided into Wafer Processing, Surface Conditioning, Chemical Mechanical Planarization, Chemical Vapor Deposition and Assembly and Packaging Equipment. On the basis of industrial vertical, it is categorized into electronics, medical and healthcare, automotive, IT and telecommunication. On the basis of region, it is studied across North America, Europe, Asia-Pacific, and LAMEA.

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