3D Semiconductor Packaging Market is Witnessing a High-Paced Growth | Major Players are: ASE group, Siliconware Precision Industries and Jiangsu Changjiang Electronics

The global 3D semiconductor packaging industry is witnessing a high-paced growth due to the need to control chip designing cost, which plays a major role in overall price of electronic devices, increase in demand for miniaturized circuits, and short replacement period of electronics products, which are primarily constituted of integrated circuits manufactured with 3D packaging technology.

3D Semiconductor Packaging Market Report, published by Allied Market Research, forecasts that the global market is expected to garner $8.9 billion by 2022, registering a CAGR of 15.7% during the forecast period. In the year 2019, Asia-Pacific dominated the global market and contributed over 50% of the overall market and its anticipated to continue this trend during the forecast period.

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The compact size and enhanced efficiency of 3D semiconductor packaged chips are key factors that drives the 3D semiconductor packaging market. The 3D semiconductor packaging industry in China is witnessing a fast-paced growth as the companies and the government of the country are investing heavily in advanced packaging technology (i.e. 3D semiconductor packaging) lead in the semiconductor industry.

Impending need of circuit miniaturization to fulfil the increased demand for portable electronics products across the globe and enhanced efficiency demand are some of the key factors that are expected to fuel the growth of the global 3D semiconductor packaging industry in coming years.
3D semiconductor packaging technologies such as 3D wire bonded and 3D TSVs are widely used in advanced 3D packaging design.

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In the year 2019, wire bonded segment held a significant share of about 44% in the overall 3D semiconductor packaging market revenue. Owing to low cost, easy availability and decent efficiency, the wire bonded technology is anticipated to hold the largest share of overall 3D semiconductor packaging market size.

Asia-Pacific is the most potential region for the manufacturers to increase their revenue and market share in the global 3D semiconductor packaging industry. Increased demand for miniaturize portable devices globally and reduction in power consumption of high-performance devices such as computers, smartphones, and others is observed to be a rising trend in this industry which will supplement the growth and increase the overall 3D semiconductor packaging market size.

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Key players such as ASE group, Siliconware Precision Industries Co., Ltd., and Jiangsu Changjiang Electronics Technology Co. Ltd. are largely engaged in the process of product innovation, collaboration, and acquisition to further expand their services across various geographies.

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Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Portland, Oregon. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of "Market Research Reports" and "Business Intelligence Solutions." AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.

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