openPR Logo
Press release

Wafer Level Packaging Market - 2026 | Industry Outlook, Market Size, Share, Key Players, Business Strategies and Revenue

02-17-2020 07:36 PM CET | Advertising, Media Consulting, Marketing Research

Press release from: Allied Market Research

Wafer Level Packaging Market

Wafer Level Packaging Market

According to a report published by Allied Market Research, titled, "Wafer Level Packaging Market by Integration Type (Fan-in WLP, Fan-out WLP), Packaging Technology (3D IC WLP, 2.5D IC WLP, 2D IC WLP, Nano WLP), Bumping Technology (Copper Pillar, Solder Bumping, Gold Bumping), Industry (Electronics, IT & Telecommunication, Industrial, Automotive) - Global Opportunity Analysis and Industry Forecast, 2014-2022", the global wafer level packaging market is expected to garner $7.8 billion by 2022, growing at a CAGR of 21.5% from 2016 to 2022.

In the year 2015, Asia-Pacific dominated the global market and contributed over half of the market share owing to improved electronics industry infrastructure and increasing demand of electronic products such as smartphones, handheld devices, PCs and laptops among others.

Access Full Summary @ https://www.alliedmarketresearch.com/wafer-level-packaging-market

Wafer level packaging is growing with a notable rate owing to its competitive advantages over other conventional packaging technologies namely wire bonding and flip chip such as compact package footprints, increased functionality, improved thermal performance, and finer pitch interconnection to the printed circuit board. Wafer level packaging (WLP) can be categorized on the basis of integration type and packaging technology used in them.

Furthermore, trending Internet of Things (IoT), technological superiority over traditional packaging techniques, and impending need of circuit miniaturization in microelectronic devices are key factors expected to propel the growth of global WLP market. Thriving demand for small sizes, low costs, and high performance of packaging solutions in electronic devices is going to act as an opportunity for wafer level packaging market.

In integration type of wafer level packaging, fan-in wafer level packaging (Fan-in WLP) dominated the market in 2015. This was attributed to the small, lightweight, high performance semiconductor solution of Fan-in WLP. However, Fan-out WLP is estimated to witness the higher growth rate in the market owing to its advances such as smaller form factor and thinner packaging with higher input/output (I/O) count along with improved thermal and electrical performance. In addition, it is a compelling, cost-effective solution for space constrained mobile applications and other portable consumer and industrial devices.

Get Up to 30% Discount - Hurry Up!
Make Purchase Enquiry @ https://www.alliedmarketresearch.com/purchase-enquiry/1694

In bumping technology, copper bumping held over 50% in the year 2015 due to its exclusive advantages of low cost, compatibility with bond pads and applications in technologies such as transceivers, embedded processors, application processors, power management, and SOCs among others. Moreover, tin-lead eutectic solder is expected to witness a highly negative growth rate due to government initiatives to ban toxic substances that have high impact on the market.

Electronics industry contributed over 47% of the overall WLP market in the year 2015. Imminent need of size reduction in electronics devices, requirement of higher data transmission speed, and improvement in efficiency collectively fuel the replacement of conventional packaging with WLP in electronics industry, hence, making it dominant in the overall market.

However, IT & telecommunication would be the fastest growing segment and is expected to register highest CAGR 25.2% during the forecast period. This is due to the increase in reach of telecommunication services in remote areas as well as introduction of new players in IT industry where WLP is used in large scale-inside servers, host systems, and data centers.

Asia-Pacific dominated the market in 2015 by accounting over 50% of the total market revenue and it is expected to maintain its dominance throughout the forecast period. This is accredited to the presence of various manufacturing facilities, high consumption, and production of electronic products where WLP is steadily replacing wire bond and ongoing R&D. Further, North America and Europe are the second and third leading regions in WLP market. These regions are expected to witness slow growth during the analysis period owing to mature electronics and IT & telecommunication industry.

"The exclusive advantages of fan-out WLP such as smaller form factor and thinner package with higher input/output (I/O) count along with improved thermal and electrical performance, makes it the exceptional wafer level integration solution. In addition, Fan-out WLP is gaining traction owing to its miniature size and fulfilling the requirement of higher integration level & increased number of external contacts in electronic devices. With the collective effect of these factors and extensive research and development activities, Fan-out WLP market is anticipated to witness a high growth in next 5-6 years." states Bhawna Kohli, Sr. Manager, Semiconductor and Electronics at AMR.

Download Sample Report @ https://www.alliedmarketresearch.com/request-sample/1694

Key findings of the study:
1. Fan-out WLP is estimated to witness the highest growth rate in the market owing to its technological advances such as smaller form factor and thinner packaging with higher input/output (I/O) count along with improved thermal and electrical performance.
2. In 2015, copper pillar led the overall WLP market revenue, and is projected to grow at a CAGR of 22.4% during the forecast period.
3. Tin-lead eutectic solder is expected to witness comparatively slow growth rate due to government initiatives to ban toxic substances that have impacted its market heavily.
4. Electronics industry constituted significant share in the overall WLP market in 2015 due to imminent need of size reduction in electronics devices, requirement of higher data transmission speed, and improvement in efficiency.
5. In integration type of WLP, fan-in WLP dominated the market in 2015 owing to small, lightweight, high performance semiconductor packaging solution. .
6. Asia-Pacific dominated the market in 2015 by accounting over 50% of the total market revenue.

The key players in the wafer level packaging market are focused on expanding their business operations in the fast-growing emerging countries with new product launches through various R&D facilities. WLP manufacturing companies have been designing the most efficient packaging solutions for the electronic product manufacturers for electric vehicles, healthcare equipment, household storage and portable electronics to launch technologically advanced products in order to increase their market share.

The major players profiled in this report include Amkor Technology Inc., Fujitsu Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., Deca Technologies, Qualcomm Inc., Toshiba Corp., Tokyo Electron Ltd., Applied Materials, Inc., ASML Holding NV, and Lam Research Corp. among others.

Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: Market Overview
Chapter 4: World Wafer Level Packaging Market, By Integration Type
Chapter 5: World Wafer Level Packaging Market, By Packaging Technology
Chapter 6: World Wafer Level Packaging Market, By Bumping Technology
Chapter 7: World Wafer Level Packaging Market, By Industry
Chapter 8: World Wafer Level Packaging Market, By Geography
Chapter 9: Company Profiles

Buy Now @ https://www.alliedmarketresearch.com/checkout-final/ea4dc29f8a153301a5caa311173a6a8c

Contact:
David Correa
5933 NE Win Sivers Drive
#205, Portland, OR 97220
United States
Toll Free (USA/Canada):
+1-800-792-5285, +1-503-894-6022, +1-503-446-1141
UK: +44-845-528-1300
Hong Kong: +852-301-84916
India (Pune): +91-20-66346060
Fax: +1-855-550-5975
help@alliedmarketresearch.com
Web: https://www.alliedmarketresearch.com

About Us:
Allied Market Research (AMR) is a full-service market research and business consulting wing of Allied Analytics LLP based in Portland, Oregon. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of "Market Research Reports" and "Business Intelligence Solutions." AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.

We are in professional corporate relations with various companies and this helps us in digging out market data that helps us generate accurate research data tables and confirms utmost accuracy in our market forecasting. Each and every data presented in the reports published by us is extracted through primary interviews with top officials from leading companies of domain concerned. Our secondary data procurement methodology includes deep online and offline research and discussion with knowledgeable professionals and analysts in the industry.

This release was published on openPR.

Permanent link to this press release:

Copy
Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.

You can edit or delete your press release Wafer Level Packaging Market - 2026 | Industry Outlook, Market Size, Share, Key Players, Business Strategies and Revenue here

News-ID: 1934889 • Views: 246

More Releases from Allied Market Research

North America Geogrid Market 2020 Segmentation, Demand, Growth, Trend, Opportuni …
According to the report published by Allied Market Research, the North America geogrid market generated $282.0 million in 2019, and is estimated to reach $408.25 million by 2027, registering a CAGR of 7.0% from 2020 to 2027. The report offers an extensive analysis of changing market dynamics, key winning strategies, business performance, major segments, and competitive scenarios. Surge in infrastructure development activities across the U.S. and Mexico and superior physical properties
Intravenous Immunoglobulin (IVIG) Market 2020 In-Depth Analysis of Industry Shar …
Global intravenous immunoglobulin market accounted for $8,995 million in 2017, and is projected to reach $15,964 million by 2025, registering a CAGR of 7.5% from 2018 to 2025. Immunoglobulin (Ig) is a plasma-derived product, which is obtained from the serum of healthy donors. The isolated plasma product is clinically treated and purified to Ig, which can be further used in the treatment of patients with antibody deficiency. Intravenous immunoglobulin (IVIG) finds
Asthma and COPD Drugs Market Is Expected to Witness a Steady Growth by 2026
"Asthma and COPD Drugs Market by Disease and Medication Class - Global Opportunity Analysis and Industry Forecasts, 2014-2022", projects that the global market for Asthma and COPD Drugs was valued at $38,960 million in 2015 and would reach $50,359 million by 2022, registering a CAGR of 3.7% from 2016 to 2022. Asthma segment dominated the market in 2015 and expected to continue its dominance throughout the forecast period. North America
Synthetic Biology Market in Global Industry by Top Companies, Type and Applicati …
Global Synthetic biology market is forecast to reach $38.7 billion by 2020, at a CAGR of 44.2% during the forecast period (2014 - 2020). Europe occupies largest share in the global market and would hold-on to its position throughout 2020. However, Asia Pacific is the fastest growing market with a CAGR of 46.4% from 2014 - 2020. Read Full Report @ https://www.alliedmarketresearch.com/synthetic-biology-market Synthetic biology is at a nascent stage and has recently

All 5 Releases


More Releases for WLP

Emerging Trends: Interposer and Fan-out WLP Market Set For Rapid Growth & Trend, …
An interposer is basically an electrical interface whose purpose is to reroute a connection to a different connection. Fan-out WLP (FOWLP) refers to a technology which is an advanced version of the standard wafer level packages and is developed to meet the demand for higher level integration and greater number of external contacts by electrical devices. It facilitates increased speed, better electrical and thermal performance, and increased number of interconnections.
Interposer and Fan-out WLP Market: Pin-point Analyses of Market Competition Dyna …
An interposer is basically an electrical interface whose purpose is to reroute a connection to a different connection. Fan-out WLP (FOWLP) refers to a technology which is an advanced version of the standard wafer level packages and is developed to meet the demand for higher level integration and greater number of external contacts by electrical devices. It facilitates increased speed, better electrical and thermal performance, and increased number of interconnections.
Interposer and Fan-Out WLP Market Size, Industry Manufacturers, Growth, Demand, …
Interposer and Fan-Out WLP Industry 2018 Global Market Research report presents an in-depth analysis of the Interposer and Fan-Out WLP market size, growth, share, segments, manufacturers, and technologies, key trends, market drivers, challenges, standardization, deployment models, opportunities, future roadmap and 2025 forecast Get Sample Copy of this Report @ https://www.orianresearch.com/request-sample/556812 . Global Interposer and Fan-Out WLP Industry Report 2018 is a professional and in-depth study on the current state of the Interposer
Interposer and Fan-out WLP Market Size and Forecast 2025 - Current Trends, Oppor …
The report "Interposer and Fan-out WLP Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2017 - 2025 ", has been prepared based on an in-depth market analysis with inputs from industry experts. The main objective of this report is to define, describe, and forecast the global “Interposer and Fan-out WLP” market on the basis of types of applications, major sectors, deployment models, organization size, and regions. The report
Global Flip Chip/WLP Manufacturing Market Trends, Analysis, Industry Growth & Fo …
A fresh report has been added to the wide database of Market Research Hub (MRH) titled “Global Flip Chip/WLP Manufacturing Market Research Report (2017-2021)” which provides an outlook of current market value as well as the expected forecast including Rate on Investment (ROI) together with growing CAGR of XX% during stated forecast from 2017-2022. The report studies the flip chip/WLP manufacturing industry worldwide, especially in North America, China, Europe, Southeast
Interposer and Fan-Out WLP Market 2017 - Global Industry Analysis and Forecast R …
The Global Interposer and Fan-Out WLP Market Research Report 2017 renders deep perception of the key regional market status of the Interposer and Fan-Out WLP Industry on a Global level that primarily aims the core regions which comprises of continents like Europe, North America, and Asia and the key countries such as United States, Germany, China and Japan. The report on “Global Interposer and Fan-Out WLP Market” is a professional report