key Opportunities and Challenges in the Noise Vibration Harshness (NVH) Testing Market

The noise vibration harshness (NVH) testing market is projected to reach USD 5.4 billion in 2024 from USD 2.8 billion in 2019, at a CAGR of 14.3%.
Will advancement in sensor and processor technologies create an opportunity?
New technological advancement in sensor and processor technologies have created new opportunities for the growth of the NVH testing market. Several companies are launching new sensor technologies having application for NVH testing equipment, thereby creating opportunities for NVH testing solution providers. For instance, in February 2014, Siemens PLM Software (US), launched LMS Soundbrush (a handheld scanning device supported by a 3D sound intensity sensor), which is capable of generating a color plotting of the various noise signals generated through an equipment and creates a 3D visualization of the sound field around that equipment. PCB Piezotronics (US) through its subsidiary--Larson Davis, US--has launched several new sensor technologies, which are used for various purposes such as detection of mining noise, airport noise, community noise, wind farm noise, and industrial noise.

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Why is limited database available dedicated to support NVH test simulation applications?
Currently, governments of many countries are setting stringent regulations to reduce or curb the sound emissions generated specifically from the automotive and aerospace and defense industries. For instance, the European Union (EU) adopted the 7th Environment Action Programme, in which, the European countries are focusing on reducing the noise generated by motor vehicles by up to 40 dB by FY 2020. According to this, there are certain guidelines that all the major automobile and aerospace and defense manufacturers have to follow to reduce the sound emission levels.
These regulations and guidelines adopted by several countries have pushed a number of manufacturers (particularly in the field of automotive and aerospace and defense) to reduce the noise generated at the subsystems level and component level, as well as the sound generated in the vehicles.

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Demand for universal memory devices across the globe is fueling the growth of the next-generation memory market

For several years, researchers have been trying to find a single universal memory that combines the benefits of Flash memory, DRAM, and SRAM. Most of the modern memory devices combine features of magnetic disks, DRAM, SRAM, and Flash memory for storing data. Traditional memory technologies such as DRAM and Flash have been dominant in the market. However, emerging nonvolatile memory technologies are making their way into the memory technology industry by replacing the existing traditional memory technologies. The primary aim of universal memory devices is to have the speed of SRAM with the nonvolatility feature of Flash. Most of the emerging nonvolatile memory technologies would become universal memory technologies in the near future. Universal memory solutions are not restricted to volatile or nonvolatile and can be used as multipurpose memory solutions. They are expected to offer cost benefits and faster programming as compared to traditional memory solutions.

Lack of stability in next-generation memory solutions under extreme environmental conditions acts as a restraint for the growth of the next-generation memory market

Stability under high temperatures and extreme environmental conditions are among the essential requirements for emerging memory technologies. The major advantage of traditional memory solutions is their stability and consistent performance offered under high temperatures. Hence, they are used in multiple applications wherein they are exposed to extreme high and low temperatures ranging from -40�C to 150�C. However, certain scalability and stability issues are encountered during the operations of most of the next-generation memory solutions in such extreme environmental conditions. The hybrid memory cubes operate at a temperature ranging between 0�C and 95�C, while ReRAM operates at temperatures ranging between 40�C and 85�C. These shortcomings of the next-generation memory technologies restrain their adoption in the market.

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This release was published on openPR.