Growing Product Demand for Consumer Electronics Devices Driving Silicon on Insulator Market

In 2018, the global silicon on insulator market generated a revenue of $684.8 million and is predicted to attain $2,285.5 million by 2024, witnessing a 22.7% CAGR during the forecast period (2019–2024).

On the basis of product, radio-frequency front-end module (RF FEM) is predicted to register the highest CAGR during the forecast period. This is because of the increasing number of 5G development projects in several countries, such as Japan, Qatar, Mexico, the U.S., China, and South Korea.

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On the basis of application, the SOI market was dominated by the automotive sector in 2018. This is primarily attributed to the rising investments by automotive giants such as Bayerische Motoren Werke (BMW) AG, Audi AG, and Robert Bosch GmbH.
For example, Audi AG announced that the company is focusing on integrating fully depleted silicon on insulator (FD-SOI) with devices or sensors that will be utilized in autonomous cars. This will result in the growing demand for SOI-based wafers, which will further drive the market.

In terms of wafer type, the FD-SOI category is expected to grow at the fastest pace during the forecast period in the SOI market. This is attributed to the growing demand from regions including Asia-Pacific (APAC) and North America for ultra-low power applications, such as smart appliances and wearable devices.

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Other key factors driving the growth of this category include the type’s relatively high performance with the integration of RF functionality and higher cost-efficiency as compared to bulk complementary metal-oxide-semiconductor and fin field-effect transistor.

A key trend in the SOI market is the miniaturization of devices and reduction in the cost of manufacturing chipsets for accelerating their adoption. The demand for miniaturization is increasing due to the rising requirement for smaller assemblies in specific applications and the need for cutting material costs by using smaller parts that function similarly to large parts.

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Miniaturization has resulted in the emergence of small devices, which are majorly being deployed in consumer electronics and automotive applications including navigation control, infotainment systems, and collision detection.

Hence, the market is advancing significantly due to the rising need for SOIs in consumer electronics applications.

Market Segmentation by Wafer Size

• Less than 200 mm
• 200 mm
• 300 mm

Market Segmentation by Technology

• Bonding
• Layer Transfer
• Smart Cut

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This release was published on openPR.