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Advanced Packaging Technologies Market is Expected to Grow at CAGR of 8.6% by 2026 | Top Players: 3M Company, Crown Holdings, Inc., Amcor Limited, PakSense Inc., Thin Film Electronics ASA

12-13-2019 02:13 PM CET | IT, New Media & Software

Press release from: Orian Research

Advanced Packaging Technologies

Advanced Packaging Technologies

Advanced Packaging Technology Market is growing at a CAGR of 8.6% from 2017 to 2026. The growth factors include increasing demand for fresh and quality packaged food, manufacturer concern for the longer shelf life of the food products, imminent requirement for size reduction in electronic devices, less power consumption. However, the heating problem in devices restrains the market growth.

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Some of the key players include in this market 3M Company, Crown Holdings, Inc., Amcor Limited, PakSense Inc., Thin Film Electronics ASA, CCL Industries Inc., Sealed Air Corporation, Vitsab International AB, Landec Corporation, Timestrip U.K. Ltd., LCR Hallcrest LLC, Bemis Company, Inc., Temptime Corporation, Cryolog S.A., SYSCO Corporation.

Advanced packaging technology is intended to the commercial reality for most integrated-circuit (IC) manufacturers is that node migrations and changes in wafer sizes are slowing down even as capital expenditures are increasing. One way for manufacturers to preserve their edge on their circuits’ small sizes, low costs, and high performance is to incorporate newer chip-packaging options such as 2.5-D integrated circuits (2.5DICs) and 3-D integrated circuits (3.0DICs) into their production processes.

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Based on Technology, the active packaging technologies systems anticipated with foods, pharmaceuticals, and several other types of products. They help extend shelf life, monitor freshness, display information on quality, improve safety, and improve convenience. Active packaging involves in having active functions beyond the inert passive containment and protection of the product. Intelligent and smart packaging usually involves the ability to sense or measure an attribute of the product, the inner atmosphere of the package, or the shipping environment.

By Geography, Asia-Pacific is expected to grow at a healthy rate, being a major revenue provoking region during the forecast period, primarily owing to the growing population and the customer-side demand.

Types Covered:
• Flip Chip
• 2.5D Integrated Circuit
• Fan Out Silicon in Package
• 2D Integrated Circuit
• 3D Integrated Circuit
• Flip Chip
• Wafer Level Chip Scale Package
• Other Type

Technologies Covered:
• Smart and Intelligent Packaging
• Active Packaging

End-Users Covered:
• Aerospace & Defense
• Consumer Electronics
• IT & Telecommunication
• Industrial
• Aerospace & Defense
• Healthcare
• Automotive & Transport
• Other End Users

• What our report offers:
o - Market share assessments for the regional and country level segments
o - Strategic recommendations for the new entrants
o - Market forecasts for a minimum of 9 years of all the mentioned segments, sub segments and the regional markets
o - Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
o - Strategic analysis: Drivers and Constraints, Product/Technology Analysis, Porter’s five forces analysis, SWOT analysis etc.
o - Strategic recommendations in key business segments based on the market estimations
o - Competitive landscaping mapping the key common trends
o - Company profiling with detailed strategies, financials, and recent developments
o - Supply chain trends mapping the latest technological advancements

Inquire more or share questions if any before the purchase on this report @ https://www.orianresearch.com/enquiry-before-buying/1067263

Table of Content:

1 Executive Summary

2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions

3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Technology Analysis
3.7 End User Analysis
3.8 Emerging Markets
3.9 Futuristic Market Scenario

4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry

5 Global Advanced Packaging Technologies Market, By Type
5.1 Introduction
5.2 Flip Chip
5.3 2.5D Integrated Circuit
5.4 Fan Out Silicon in Package
5.5 2D Integrated Circuit
5.6 3D Integrated Circuit
5.7 Flip Chip
5.8 Wafer Level Chip Scale Package
5.9 Other Types

6 Global Advanced Packaging Technologies Market, By Technology
6.1 Introduction
6.2 Smart and Intelligent Packaging
6.2.1 Radio Frequency Identification (RFID)
6.2.2 Freshness Indicators
6.2.3 TTI Tags & Labels
6.2.4 Oxygen and CO2 Indicators
6.2.5 Other Technologies
6.3 Active Packaging
6.3.1 Temperature Control Packaging
6.3.2 Modified Atmosphere Packaging
6.3.3 Active Packaging Systems
6.3.3.1 Ethylene Absorbers
6.3.3.2 Moisture Scavengers/Absorbers
6.3.3.3 Oxygen Scavengers
6.3.4 Active Releasing Systems
6.3.4.1 Carbon Dioxide Emitters
6.3.4.2 Antioxidant Releasers

7 Global Advanced Packaging Technologies Market, By End User
7.1 Introduction
7.2 Aerospace & Defense
7.3 Consumer Electronics
7.4 IT & Telecommunication
7.5 Industrial
7.6 Healthcare
7.7 Automotive & Transport
7.8 Other End Users

8 Global Advanced Packaging Technologies Market, By Geography
8.1 Introduction
8.2 North America
8.2.1 US
8.2.2 Canada
8.2.3 Mexico
8.3 Europe
8.3.1 Germany
8.3.2 UK
8.3.3 Italy
8.3.4 France
8.3.5 Spain
8.3.6 Rest of Europe
8.4 Asia Pacific
8.4.1 Japan
8.4.2 China
8.4.3 India
8.4.4 Australia
8.4.5 New Zealand
8.4.6 South Korea
8.4.7 Rest of Asia Pacific
8.5 South America
8.5.1 Argentina
8.5.2 Brazil
8.5.3 Chile
8.5.4 Rest of South America
8.6 Middle East & Africa
8.6.1 Saudi Arabia
8.6.2 UAE
8.6.3 Qatar
8.6.4 South Africa
8.6.5 Rest of Middle East & Africa

9 Key Developments
9.1 Agreements, Partnerships, Collaborations and Joint Ventures
9.2 Acquisitions & Mergers
9.3 New Product Launch
9.4 Expansions
9.5 Other Key Strategies

10 Company Profiling
10.1 3M Company
10.2 Crown Holdings, Inc.
10.3 Amcor Limited
10.4 PakSense Inc.
10.5 Thin Film Electronics ASA
10.6 CCL Industries Inc.
10.7 Sealed Air Corporation
10.8 Vitsab International AB
10.9 Landec Corporation
10.10 Timestrip U.K. Ltd.
10.11 LCR Hallcrest LLC
10.12 Bemis Company, Inc.
10.13 Temptime Corporation
10.14 Cryolog S.A.
10.15 SYSCO Corporation

Contact Us
Ruwin Mendez
Vice President – Global Sales & Partner Relations
Orian Research Consultants
US: +1 (832) 380-8827 | UK: +44 0161-818-8027
Email: info@orianresearch.com

About Us
Orian Research is one of the most comprehensive collections of market intelligence reports on the World Wide Web. Our reports repository boasts of over 500000+ industry and country research reports from over 100 top publishers. We continuously update our repository so as to provide our clients easy access to the world's most complete and current database of expert insights on global industries, companies, and products. We also specialize in custom research in situations where our syndicate research offerings do not meet the specific requirements of our esteemed clients.

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