Semiconductor IP Market Size, Share, Analysis and Forecasts 2025 Verisilicon, Rambus, Ceva, Imagination Technologies, Synopsys, Ememory Technology, and Lattice Semiconductor

Growth in the recent five years is primarily driven by the following major factors, such as increasing automation integrations in the highly prominent manufacturing sector worldwide, design complexities of consumer electronic devices, and growing needs for high-speed IC designing capabilities facilitating lesser time-to-market for the products.

Semiconductor IP market accounted to US$3,346.1 Mn in 2017 and is expected to grow at a CAGR of 11.9% during the forecast period 2018 - 2025, to account to US$8,265.6 Mn by 2025.

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The top companies operating in the field of Semiconductor IP include Cadence Design Systems, Sonics, ARM Holdings, Verisilicon, Rambus, Ceva, Imagination Technologies, Synopsys, Ememory Technology, and Lattice Semiconductor among others. Various other companies operating in the market and are coming up with new technologies and offerings which is helping the market for Semiconductor IP to expand over the years in terms of revenue and subscription.

The global Semiconductor IP market is experiencing an intense growth with regards to the investments, new product developments, and deployment for future in the current scenario and is anticipated to rise in the coming years. The semiconductor IP market consists of some well-established players across the globe, which invest huge amounts in order to deliver the most advanced product to the customers. Also, there are many stakeholders in the Semiconductor IP ecosystem that are involved in the end-to-end development of Semiconductor IP and ensuring that the best service is made available for the users.

Government funding for research & development, automotive manufacturers, communication equipment manufacturers, strategic partnerships between chipset manufacturers, equipment vendors, network operators and Government bodies are anticipated to enable huge surges in the Semiconductor IP market over the forecast period.

In the twenty first century, the upcoming electronic and semiconductor technologies are paving way for automation to be introduced heavily in the manufacturing sector. Over the past two decades, automation in manufacturing has been a constant factor leading to transformation in the factory floor operations, manufacturing employment, as well as the dynamics of the manufacturing sector on a whole. Current trends that are buzzing in the manufacturing sector such as robotics, machine learning, and artificial intelligence have enabled the machines to match or even outpace humans in a range of activities including the cognitive activities that are required at various levels of manufacturing. An increased productivity ranging between 10-20% is observed when automation is integrated on any lean assembly line. Further, Industry 4.0 is another buzzing trend that is anticipated to take up the manufacturing sector in the coming years. The advent of Industry 4.0 or the Industrial Internet of Things (IIoT) that would utilize the powers of collaborative robots, and automated guided vehicles is further anticipated to drive productivity in the manufacturing sector.

Electronics sector is anticipated to be one of the largest adopters of the Semiconductor IP globally. Manufacturing of automotive, consumer electronics, communication equipment, healthcare related equipment, and other devices are leading the integrations of semiconductor IP products into the different assembly lines at the factory floor. Also, the trend towards miniaturization in the consumer electronics industry has driven package component sizes down to the design-rule level of early technologies. Crucial in integrated circuit (IC) package technology is that it must deliver higher lead counts, reduced lead pitch, minimum footprint area, and significant volume reduction. As a result, this has led to semiconductor manufacturers developing the small outline package (SOP), surface-mount memory packaging.

Strategic Insights
Few of the recent strategies by some of the players in semiconductor IP market landscape are listed below-
2018: CEVA and Nokia Collaborated for 4.9G and 5G Technologies. This collaboration is a direct result of CEVA's strong competencies and investment in advanced DSP technologies for next generation heterogeneous networks. It further expands CEVA's foothold as the end-to-end wireless DSP provider, covering base stations, cellular IoT, terminals, and any other form of cellular enabled device.

2018: Arm unveiled it has expanded design possibilities with free Cortex-M processors for Xilinx FPGAs through collaboration with Xilinx. The New no royalties, no license fee access model designed to support more developers benefit from industry-leading Arm technology, with a common software base across their whole device portfolio.

2018: Sonics Inc. partnered with SiFive, the leading provider of processor core IP based on the RISC-V instruction set architecture. Under this partnership, both the company's focus to facilitate agile RISC-V SOC design platform with IP industry's most widely used NOCs.

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