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Lanner’s Newest Fanless In-Vehicle Computer With the Dual Core Intel® Atom™

07-27-2011 09:43 AM CET | IT, New Media & Software

Press release from: Lanner Electronics

The angled view of the fanless in-vehicle LEC-5510

The angled view of the fanless in-vehicle LEC-5510

(Taipei, Taiwan- July 27th, 2011) Today, Lanner Electronics released a next generation in-vehicle platform, the LEC-5510. Tested thoroughly for both shock and vibration, the LEC-5510 is designed to be used in all mobile land vehicles, including: construction equipment, semis, cabs, vans, trains and buses. Lanner’s latest platform is based around the dual core Intel® Atom D510™ and features plenty of I/O.

To withstand vibration and shock, the LEC-5510 is designed with multiple safeguards for a longer lasting platform. There is a 1GB memory chip directly on the motherboard to protect from RAM dislodgement due to vibration. The hard drive bay incorporates rubber pads and an additional protective casing to give extra dampening. Many of the I/O ports come in a DB9 or terminal block form factors which screw the connector directly into the appliance to ensure secure connections. Finally the LEC-5510 has a completely cable-less interior and comes standard without a fan, which increases product longevity. The platform has been tested for vibrations up to 2g at 5-500Hz and shock along all three axes at 30grms acceleration.

“The LEC-5510 is Lanners newest and most powerful mobile appliance,” said Eric Chiu, head of Lanner’s Applied Computing department, “we have positioned the platform to be stalwart in the industry and encompass all of our customers needs. Along with the regular CE and FCC certifications we have tested the platform to meet the e13 (emark) certification for in-vehicle computers.”

Along with other Lanner in-vehicle appliances, the LEC-5510 features power ignition control, which allows in-vehicle IPCs to switch seamlessly between vehicle power to battery power and vice-versa. The controller is able to sense when the vehicle is turned on and off, allowing the appliance to only use the back battery when necessary.

The LEC-5510 uses the 1.66GHz dual core Intel Atom D510 processor with the ICH8M chipset. It has Intel Ethernet (2 x Intel 82574L) Controllers and Intel Graphic Controllers (Intel GMA3150). Along with the 1GB onboard RAM there is also a SODIMM slot for DDR2 memory, which can hold up to 2GB of memory for a maximum of 3GBs.

The platform is made to serve multiple in-vehicle applications and comes with a variety of I/O including: 4 x USB 2.0, 2 x serial, audio, VGA and digital I/O. The LEC-5510 also comes with a Holux GR89 GPS receiver as well as 2 x Mini-PCIe slots. One of the Mini-PCIe expansion slots is attached to a SIM card reader, allowing for 3G connectivity.

Lanner engineers have designed the LEC-5510 to have expansion via a PCI 104 slot. Some modules that are already in the design phase include: a 4-port Video Encode module, an add-on external fan kit and additional I/O ports in the M16 form factor.

The platform has been extensively tested and when equipped with industrial components (hard drives, RAM and CF) it has a temperature range between -20 and 55o Celsius. The LEC-5510 also features a wide power input range between 6 and 30V of DC power.

For more information about the Lanner LEC-5510 please check out the datasheet here:
http://www.lannerinc.com/invehicle/LEC-5510
Or you can talk to a Lanner representative at sales@lannerinc.com.

Founded in 1986 and publicly listed (TAIEX 6245) since 2003, Lanner Electronics, Inc. is an ISO 9001 certified designer and manufacturer of network application platforms, network video platforms and applied computing hardware for first-tier companies. Lanner's expertise also extends to include driver and firmware support, enabling customers to optimize hardware and software communication to achieve faster time to market. With headquarters in Taipei, Taiwan and branches in the U.S. and China, Lanner is uniquely positioned to deliver custom technical solutions with localized, value-added service. Lanner is an Associate Member of the Intel® Embedded and Communications Alliance, a group of companies committed to developing modular, standards-based solutions based on technologies, processors, products, and services from Intel®.

Lanner Electronics Inc.
7F, 173, section 2 Datong road
XiZhi District, New Taipei City 221, Taiwan

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