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Global System in Package Market Market : Present Scenario on Growth Analysis and High Demand to 2023

08-13-2019 08:48 AM CET | Business, Economy, Finances, Banking & Insurance

Press release from: ReportsandReports

Global System in Package Market Market : Present Scenario

Get free Sample Research Report of System in Package Market spread across 154 pages, profiling 13 companies and supported with 56 tables and 52 figures is now available @ https://www.reportsnreports.com/contacts/requestsample.aspx?name=283159

The Global report titled “System in Package Market” delivering key insights and providing a competitive advantage to clients through a detailed report. The report contains 154 pages which highly exhibit on current market analysis scenario, upcoming as well as future opportunities, revenue growth, pricing and profitability. An exclusive data offered in this report is collected by research and industry experts team.

The System in Package Market is expected to grow from USD 5.79 Billion in 2017 to USD 9.07 Billion by 2023, at a CAGR of 9.4% during 2017–2023.

Major Vendors profiled in the System in Package Market include are ASE Group (Taiwan), Amkor Technology (US), SPIL (Taiwan), Power tech Technology (Taiwan), UTAC (Global A&T Electronics) (Singapore), Intel (US), Samsung Electronics (South Korea), JCET (China), Chipmos Technologies (Taiwan), Chip bond Technology (Taiwan), KYEC (Taiwan), Texas Instruments (US), Signetics (South Korea), Unisem (Malaysia), Carsem (Malaysia), FATC (Taiwan), Inari Amertron Berhad (Malaysia), Ardentec (Taiwan), Alchip (Taiwan), Hana-Micron (South Korea), OSE (Taiwan), Greatek Electronics (Taiwan), Tainshui Huatian Technology (China), AOI Electronics (Japan), Lingsen Precision Industry (Taiwan), Nepes (South Korea), Tongfu Microelectronics (China), and Sigurd Microelectronics (Taiwan).

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“3D IC expected to grow at the highest CAGR of the system in package market on the basis of packaging technology during the forecast period”
The 3D IC market is expected to grow at the highest CAGR during the forecast period. The compact structure of 3D IC packaging technology further increases its demand in various smart technologies. Moreover, the major factors driving the system in package market for 3D IC packaging technology include the highest interconnect density and greater space efficiencies in 3D IC compared with all other types of packaging technology such as 2D and 2.5 D.

“Consumer electronics application expected to hold the largest share of the overall system in package market in 2017”
Smart phones and tablets are observed to have the highest adoption among all the consumer electronic devices owing to their small form factor and better performance requirements to operate at a higher bandwidth. As a result, many ICs need to be incorporated into a single chip module for reducing the board space while considering cost and the overall time-to-market. In addition, consumer electronics products, such as mobile phones, tablets, net book PCs, digital video cameras, and gaming controllers are adopting the advanced architecture.

“System in package market in APAC expected to hold the largest share in 2017”
The overall system in package market in APAC is expected to hold the largest share in 2017, and because of the presence of major IC packaging and wafer suppliers in this region. This makes the integration of 2D, 2.5D, and 3D IC packaging technology in APAC much easier.

Target Audience for System in Package Market:
• Raw material and manufacturing equipment suppliers
• Semiconductor foundry players
• Integrated circuit designers
• Outsourced semiconductor assembly & testing services (OSATS) players
• System in package packaging and test services
• System in package semiconductor device manufacturers
• System in package component manufacturers
• System in package original equipment manufacturers (OEMs)
• Integrated device manufacturers (IDMs)
• Research institutes and organizations

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