Flip Chip Technology Market 2019 Global Leaders: ASE, Amkor Technology, STATS ChipPAC, Global Foundries, STMicroelectronics, Texas Instruments

Market Research Future published a research report on “Flip Chip Technology Market Report- Forecast till 2023” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2023.

Market Insights

A flip chip is a type of semiconductor device that is specially designed to incorporate solder bumps over the connection pads of the micro-electromechanical system (MEMS) which then creates a reliable connection between the component and the board. Market Research Future has studied the global flip chip market closely over the forecast period from 2017 to 2023. The global flip chip market is slated to grow at a CAGR of 8.29% during the assessment period.

The use of flip chips uses the concept of assembling a semiconductor chip face down on the circuit board to accommodate size considerations of an electronic device. This reduces the packaging cost and offers high performance in high-frequency applications. Flip chip bumping, as it is termed is a vital part of the process and provides the crucial electrical connection between the die and substrate, provides thermal conductivity between two materials and works as a spacer to prevent electrical problems. It also provides mechanical support. The developments in the packaging of electronics such as improving performance and maintaining a high packaging density are some key factors driving the growth of the global flip chip market. The increase in reliability of circuits is also an important factor which drives growth. The consumer electronics market, as well as the general demand for electronics across all sectors, is expected to drive the global flip chip market.

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It should be noted that the high costs of implementation of flip chip technology are expected to hamper the growth of the market to a certain degree.

Key Players

Some of the major players in Flip Chip Technology Market are Samsung Group (South Korea), Intel Corporation (U.S.), Global Foundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland), Texas Instruments (U.S.) among others.

Segmentation:

The global Flip Chip Technology Market can be segmented by wafer bumping process, packaging technology, packaging type, product, and application.

Based on the wafer bumping process, the flip chip technology market can be segmented into copper (CU) pillar, lead-free, Tin-lead eutectic solder and gold stud plated solder.

Based on the packaging technology, the flip chip technology market includes 2D, 2.5D, and 3D packaging technology.

Based on the packaging type, the flip chip technology market comprises FC BGA (Flip Chip Ball Grid Array), FC PGA (Flip Chip Pin Grid Array), FC LGA (Flip Chip Land Grid Array), FC QFN (Flip Chip Quad Flat No-Lead), FC SIP (Flip Chip System-In-Package), and FC CSP (Flip Chip-Chip-Scale Package).

Product-based segmentation of the flip chip technology market includes LED, CMOS image sensor, CPU, RF, Analog, Mixed Signal, and Power IC, SoC, and others.

Regional Analysis:

The global flip chip technology market spans across regions such as North America, Europe, Asia Pacific (APAC), and the Rest-of-the-World (RoW).

The APAC region is leading the market with considerable margin, and its status will remain so during the forecast period. Countries such as China and India have emerged as exceptional manufacturing zones. These countries can further increase the flip chip technology market percolation opportunity. Big names such as Sony and Samsung are also from the region which is taking the market further ahead. North America is the second largest market, and it is due to the presence of a huge number of flip chip technology market behemoths. The region is also investing significantly in research and developments.

Industry Trend:

Tokyo Denkikagaku Kōgyō Corporation (TDK) recently showcased the upgraded model of AFM GGI flip chip model which features new horn designs to provide linear X-Y nozzle movement for die sizes up to 10mm2. This will increase its performance and bring-in a lead-free process.

Kulicke & Soffa Industries announced the launch of Katalyst that boasts of leading-edge technology to provide high accuracy flip chip bonder. Its advanced capabilities ensure better performance in automated ground vehicles (AGV).

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Intended Audience

Wafer manufacturers
Raw material and manufacturing equipment suppliers
Chip manufacturers
System integrators
Device manufacturers
Foundry players
Distributors and retailers
Research organizations

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This release was published on openPR.