Ball Grid Array (BGA) Package Market 2019: Development, Opportunity, Growth by Top Key Players (Intel, NexLogic Technologies, Texas Instruments, Palomar Technologies, Micro Systems Technologies, Sonix, Advanced Interconnections Corp etc.)

The Ball Grid Array (BGA) Package Market report presents a comprehensive overview, market shares, and growth opportunities of Ball Grid Array (BGA) Package market by product type, application, key manufacturers and key regions and countries. The research report analyzes the market size, industry share, growth, key segments, CAGR and key drivers.

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A Ball Grid Array or BGA package is a form of surface mount technology, or SMT package that is being used increasingly for integrated circuits. The Ball Grid Array, BGA, uses a different approach to the connections to that used for more conventional surface mount connections. Other packages such as the quad flat pack, QFP, used the sides of the package for the
connections.

This meant that there was limited space for the pins which had to be spaced very closely and made much smaller to provide the required level of connectivity. The Ball Grid Array, BGA, uses the underside of the package, where there is a considerable area for the connections.

The Major players include in this study:
• Intel
• NexLogic Technologies
• Texas Instruments
• Palomar Technologies
• Micro Systems Technologies
• Sonix
• Advanced Interconnections Corp
• ...

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The Ball Grid Array, BGA package was developed out of the need to have a more robust and convenient package for integrated circuits with large numbers of pins. With the levels of integration rising, some integrated circuits had in excess of 100 pins.

Ball Grid Array (BGA) Package Market research report delivers a close watch on leading competitors with strategic analysis, micro and macro market trend and scenarios and a holistic overview of the market situations in the forecast period. It is a professional and a detailed report focusing on primary and secondary drivers, market share, leading segments and geographical analysis.

This report focuses on the global Ball Grid Array (BGA) Package status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Ball Grid Array (BGA) Package development in United States, Europe and China.

Market segment by Type, the product can be split into
• Common BGA package
• Flip Chip BGA Package

Market segment by Application, split into
• PCBs
• Other

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Major Topics Covered in this Report:
1 Report Overview
2 Global Growth Trends
3 Market Share by Key Players
4 Breakdown Data by Type and Application
5 United States
6 Europe
7 China
8 Japan
9 Southeast Asia
10 India
11 Central & South America
12 International Players Profiles
13 Market Forecast 2019-2025
14 Analyst's Viewpoints/Conclusions
15 Appendix

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