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Ball Grid Array (BGA) Package Market 2019: Development, Opportunity, Growth by Top Key Players (Intel, NexLogic Technologies, Texas Instruments, Palomar Technologies, Micro Systems Technologies, Sonix, Advanced Interconnections Corp etc.)

07-15-2019 09:12 AM CET | IT, New Media & Software

Press release from: Orian Research

Ball Grid Array (BGA) Package Market

Ball Grid Array (BGA) Package Market

The Ball Grid Array (BGA) Package Market report presents a comprehensive overview, market shares, and growth opportunities of Ball Grid Array (BGA) Package market by product type, application, key manufacturers and key regions and countries. The research report analyzes the market size, industry share, growth, key segments, CAGR and key drivers.

Get Sample Copy of This Report at https://www.orianresearch.com/request-sample/999146

A Ball Grid Array or BGA package is a form of surface mount technology, or SMT package that is being used increasingly for integrated circuits. The Ball Grid Array, BGA, uses a different approach to the connections to that used for more conventional surface mount connections. Other packages such as the quad flat pack, QFP, used the sides of the package for the
connections.

This meant that there was limited space for the pins which had to be spaced very closely and made much smaller to provide the required level of connectivity. The Ball Grid Array, BGA, uses the underside of the package, where there is a considerable area for the connections.

The Major players include in this study:
• Intel
• NexLogic Technologies
• Texas Instruments
• Palomar Technologies
• Micro Systems Technologies
• Sonix
• Advanced Interconnections Corp
• ...

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The Ball Grid Array, BGA package was developed out of the need to have a more robust and convenient package for integrated circuits with large numbers of pins. With the levels of integration rising, some integrated circuits had in excess of 100 pins.

Ball Grid Array (BGA) Package Market research report delivers a close watch on leading competitors with strategic analysis, micro and macro market trend and scenarios and a holistic overview of the market situations in the forecast period. It is a professional and a detailed report focusing on primary and secondary drivers, market share, leading segments and geographical analysis.

This report focuses on the global Ball Grid Array (BGA) Package status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Ball Grid Array (BGA) Package development in United States, Europe and China.

Market segment by Type, the product can be split into
• Common BGA package
• Flip Chip BGA Package

Market segment by Application, split into
• PCBs
• Other

Place a Direct Order Of this Report @ https://www.orianresearch.com/checkout/971922

Major Topics Covered in this Report:
1 Report Overview
2 Global Growth Trends
3 Market Share by Key Players
4 Breakdown Data by Type and Application
5 United States
6 Europe
7 China
8 Japan
9 Southeast Asia
10 India
11 Central & South America
12 International Players Profiles
13 Market Forecast 2019-2025
14 Analyst's Viewpoints/Conclusions
15 Appendix

Contact Us
Ruwin Mendez
Vice President – Global Sales & Partner Relations
Orian Research Consultants
US: +1 (415) 830-3727 | UK: +44 020 8144-71-27
Email: info@orianresearch.com

About Us
Orian Research is one of the most comprehensive collections of market intelligence reports on The World Wide Web. Our reports repository boasts of over 500000+ industry and country research reports from over 100 top publishers. We continuously update our repository so as to provide our clients easy access to the world's most complete and current database of expert insights on global industries, companies, and products. We also specialize in custom research in situations where our syndicate research offerings do not meet the specific requirements of our esteemed clients.

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