Press release
What’s Driving the Molded Interconnect Devices Market Trends? Key Companies - Molex, RTP Company, TE Connectivity, BASF, DSM, Evonik, LANXESS, RTP Company
Molded Interconnect Devices Market
The surge in the use of consumer electronic devices including smartphones, tablets, and televisions is anticipated to drive the molded interconnect devices market growth. These components are increasingly integrated into the smart devices owing to their reduced size and energy-saving features. The antenna integrated components provide enhanced mechanical and electronic enclosure development to the manufacturers.
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The major players operating in the market-
1. Galtronics Corporation Ltd.
2. LPKF Laser & Electronics AG
3. Molex
4. RTP Company
5. TE Connectivity
6. BASF
7. DSM
8. EMS-CHEMIE (Business Unit EMS-GRIVORY)
9. Ensinger GmbH
10. Evonik
11. LANXESS
12. RTP Company
Major Key Points from Table of Content:
Chapter 4. MID Market, By Process
4.1. Key trends by process
4.2. Laser direct structuring (LDS)
4.2.1. Market estimates and forecast, 2013-2024
4.2.2. Market estimates and forecast, by end-use, 2013-2024
4.2.3. Market estimates and forecast, by region, 2013-2024
4.3. Two-shot molding
4.3.1. Market estimates and forecast, 2013-2024
4.3.2. Market estimates and forecast, by end-use, 2013-2024
4.3.3. Market estimates and forecast, by region, 2013-2024
4.4. Others
4.4.1. Market estimates and forecast, 2013-2024
4.4.2. Market estimates and forecast, by end-use, 2013-2024
4.4.3. Market estimates and forecast, by region, 2013-2024
Chapter 5. MID Market, By End-Use
5.1. Key trends by end-use
5.2. Automotive
5.2.1. Market estimates and forecast, 2013-2024
5.2.2. Market estimates and forecast, by process 2013 – 2024
5.2.3. Market estimates and forecast, by region 2013 – 2024
5.3. Consumer products
5.3.1. Market estimates and forecast, 2013-2024
5.3.2. Market estimates and forecast, by process 2013 – 2024
5.3.3. Market estimates and forecast, by region 2013 – 2024
5.4. Healthcare
5.4.1. Market estimates and forecast, 2013-2024
5.4.2. Market estimates and forecast, by process 2013 – 2024
5.4.3. Market estimates and forecast, by region 2013 – 2024
5.5. Industrial
5.5.1. Market estimates and forecast, 2013-2024
5.5.2. Market estimates and forecast, by process 2013 – 2024
5.5.3. Market estimates and forecast, by region 2013 – 2024
5.6. Military & aerospace
5.6.1. Market estimates and forecast, 2013-2024
5.6.2. Market estimates and forecast, by process 2013 – 2024
5.6.3. Market estimates and forecast, by region 2013 – 2024
5.7. Telecommunication & computing
5.7.1. Market estimates and forecast, 2013-2024
5.7.2. Market estimates and forecast, by process 2013 – 2024
5.7.3. Market estimates and forecast, by region 2013 – 2024
5.8. Others
5.8.1. Market estimates and forecast, 2013-2024
5.8.2. Market estimates and forecast, by process 2013 – 2024
5.8.3. Market estimates and forecast, by region 2013 – 2024
In the molded interconnect devices market, the Laser Direct Structuring (LDS) process segment is anticipated to gain traction over the coming years owing to the ease of processing and low development & tooling costs associated with the manufacturing processes. It consists of a one-step process that integrates plastic creation on the device and enhances the component performance. The MID market is driven by benefits provided by the LDS processes such as the elimination of hazardous chemical pre-treatment and lesser environmental impacts over the legacy processes.
The healthcare sector in the molded interconnect devices market is predicted to dominate owing to the growing use of these components in devices such as blood pressure monitors, glucose meters, and oxygen meters that enables improved patient diagnostics. The 3D assemblies of components in medical devices help in enhancing the circuit designs and minimizing the size. These are increasingly being used by dentists and medical pathology labs, thereby driving the molded interconnect devices market growth.
Browse Complete Report Summary @ https://www.gminsights.com/industry-analysis/molded-interconnect-devices-MID-market
In the Asia Pacific molded interconnect devices market, countries including China, Japan, and South Korea are expected to witness several growth opportunities owing to the presence of major consumer electronics manufacturers. These components enable ease of processing and low energy consumption thereby benefiting the manufacturing companies. Growth in the disposable income and increased spending capacity of consumers in the Asia Pacific region are further providing an impetus to the MID market growth. Penetration and presence of several raw material suppliers and the growth in the export activities from these countries account for large revenue shares in the industry.
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Arun Hegde
Corporate Sales, USA
Global Market Insights, Inc.
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Global Market Insights, Inc., headquartered in Delaware, U.S., is a global market research and consulting service provider; offering syndicated and custom research reports along with growth consulting services. Our business intelligence and industry research reports offer clients with penetrative insights and actionable market data specially designed and presented to aid strategic decision making. These exhaustive reports are designed via a proprietary research methodology and are available for key industries such as chemicals, advanced materials, technology, renewable energy and biotechnology
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