Press release
Redistribution Layer Material Market To Reach US$ 794.5 Mn by 2027 at a CAGR of 25.7% | Leading Players Advanced Semiconductor Engineering, Amkor Technology, Fujifilm Holdings Corporation, Hitachi Chemical DuPont MicroSystems, Infineon Technologies AG
Redistribution Layer Material Market
The global redistribution layer material market by material was led by polyimide segment. The other materials for redistribution layer material market include FEpoxy (phenol & acrylates based), metal and Silicones. A polymer material is required for redistribution layer in the advanced packaging techniques that catalyzes in routing the connection between the solder bumps and the I/O pads. The materials used for redistribution are used as passivation layer for bumping and stress buffers. There are a certain set of physical characteristics required in the dielectric material used for RDL in the advanced packaging applications that include low cure temperature, low dielectric constant, higher chemical and mechanical stabilities.
Leading Key Players
Advanced Semiconductor Engineering, Inc. (ASE group), Amkor Technology, Fujifilm Holdings Corporation, Hitachi Chemical DuPont MicroSystems, Infineon Technologies AG, Jiangsu Changjiang Electronics Technology Co., Ltd.(JCET), NXP Semiconductors N.V., Samsung Electronics Co. Ltd, Shin-Etsu Chemical Co, SK HYNIX, Sumitomo Bakelite Co., Ltd, The Dow Chemical Company, Toray Industries, Taiwan Semiconductor Manufacturing Company Ltd.
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Material Insights
The global redistribution layer material market by material was led by polyimide segment. The other materials for redistribution layer material market include FEpoxy (phenol & acrylates based), metal and Silicones. A polymer material is required for redistribution layer in the advanced packaging techniques that catalyzes in routing the connection between the solder bumps and the I/O pads. The materials used for redistribution are used as passivation layer for bumping and stress buffers. There are a certain set of physical characteristics required in the dielectric material used for RDL in the advanced packaging applications that include low cure temperature, low dielectric constant, higher chemical and mechanical stabilities.
Strategic Insights
The market players present in redistribution layer material market are mainly focusing towards product enhancements by implementing advance technologies. By signing partnership, contracts, joint ventures, funding, and inaugurating new offices across the world permit the company maintain its brand name globally. Most of the market initiative were observed in Asia Pacific, North America, Europe regions, which have high density of semiconductor manufacturing industries.
Few of the recent developments are listed below:
• 2018: Sumitomo Bakelite Co., Ltd. and Sumitomo Dainippon Pharma Co., Ltd. together announced the establishment of a new joint company, SB Bioscience Co., Ltd. By combining the know-how of in-vitro diagnostics of DS Pharma Biomedical Co., Ltd. and the technologies of Sumitomo Bakelite Co., Ltd., both the companies focus to accelerate new diagnostics development and make a further contribution to the society.
• 2018: ASE Group unveiled its plan to build K25 Factory Building in Kaohsiung. The K25 building will be ASE’s state of the art facility with an intelligent manufacturing processes, high degree of automation, and smart logistics.
• 2018: Advanced Semiconductor Engineering, Inc. collaborated with Cadence Design Systems, Inc. to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages. This solution handles heterogeneous and homogeneous chip integration with high-density packaging to enhance the efficiency of chip and passive design optimization.
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Major Key questions answered through this research report:
• What are the top key players of the global redistribution layer material market?
• What are the strengths and weaknesses of the global redistribution layer material market?
• What are the highest competitors in the market?
• What are the different marketing and distribution channels?
• What are the global market opportunities in front of the market?
• What are the key outcomes of SWOT and Porter’s five techniques?
• What is the global market size and growth rate in the forecast period?
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