Outsourced Semiconductor Assembly and Test Market Exploring Future Growth 2019-2024 and Key Players - ASE Group, Amkor, JECT, SPIL, Powertech Technology, TSHT, TFME

OSAT stands for Outsourced Semiconductor Assembly and Test. This report focuses on OSAT Providers. Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services. The OSATs are merchant vendors. IDMs and foundries with internal packaging operations also outsource a certain percentage of their IC-packaging production to the OSATs. The fabless companies also outsource their packaging to the OSATs and/or foundries.

Increased demand for outsourced SATS or OSAT services will be a remarkable trend favoring the growth of the global SATS market. With the rapidly thriving consumer electronics industry, the demand for connectivity and mobility is also on the rise, which is foreseen to be an important booster to the demand for connected devices, eventually fostering the semiconductor assembly and testing services market.

United States has the largest global export quantity and manufacturers in OSAT market, while the Taiwan is the second sales market for OSAT in 2017. In the industry, ASE Group profits most in 2017 and recent years, while Amkor and JECT ranked 2 and 3.The market share of them is 18.81%, 15.13% and 13.02% in 2017.The gap of market share is keep on enlarged due to different strategy.

Top Companies Covered in this Report:
ASE Group, Amkor, JECT, SPIL, Powertech Technology, TSHT, TFME, UTAC, Chipbond, ChipMOS, KYEC, Unisem, Walton Advanced Engineering, Signetics, Hana Micron,

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According to this study, over the next five years the Outsourced Semiconductor Assembly and Test (OSAT) market will register a 4.3% CAGR in terms of revenue, the global market size will reach US$ 36100 million by 2024, from US$ 29300 million in 2019. In particular, this report presents the global revenue market share of key companies in Outsourced Semiconductor Assembly and Test (OSAT) business, shared in Chapter 3.

The report has been collated as a result of the qualitative and quantitative research, first-hand information, and inputs from industry professionals and industry participants across the value chain. The study also provides a detailed assessment of the current market trends, micro- and macroeconomic indicators and governing factors, as well as the market attractiveness, as per the segments and sub-segments. The report also focuses on the qualitative impact of the different Outsourced Semiconductor Assembly and Test market factors on market segments and geographies.

Major Types of Outsourced Semiconductor Assembly and Test covered are:
Test Service
Assembly Service

Major Applications of Outsourced Semiconductor Assembly and Test covered are:
Communication
Computing & networking
Consumer electronics
Others

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Fundamentals of Table of Content:

1 Report Overview
1.1 Study Scope
1.2 Key Market Segments
1.3 Players Covered
1.4 Market Analysis by Type
1.5 Market by Application
1.6 Study Objectives
1.7 Years Considered

2 Global Growth Trends
2.1 Outsourced Semiconductor Assembly and Test Market Size
2.2 Outsourced Semiconductor Assembly and Test Growth Trends by Regions
2.3 Industry Trends

3 Market Share by Key Players
3.1 Outsourced Semiconductor Assembly and Test Market Size by Manufacturers
3.2 Outsourced Semiconductor Assembly and Test Key Players Head office and Area Served
3.3 Key Players Outsourced Semiconductor Assembly and Test Product/Solution/Service
3.4 Date of Enter into Outsourced Semiconductor Assembly and Test Market
3.5 Mergers & Acquisitions, Expansion Plans

4 Breakdown Data by Product
4.1 Global Outsourced Semiconductor Assembly and Test Sales by Product
4.2 Global Outsourced Semiconductor Assembly and Test Revenue by Product
4.3 Outsourced Semiconductor Assembly and Test Price by Product

5 Breakdown Data by End User
5.1 Overview
5.2 Global Outsourced Semiconductor Assembly and Test Breakdown Data by End User

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In the last section of the report, the global Outsourced Semiconductor Assembly and Test market additionally provides a detailed survey of the key competitors and the leading players in the market, based on the various objectives of an organization such as overview, profiling, product portfolio, the quantity of production, upstream raw material, downstream demand analysis, and the financial status of the organization. These key players have adopted the regional expansion, mergers & acquisitions, product portfolio expansion, partnerships, and collaborations as their key strategies to enhance their infiltration in the Global Outsourced Semiconductor Assembly and Test Market.

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