Global Back End of the Line Semiconductor Equipment Market Depth Survey Report 2019 - QY Research

Back End of Line Semi-Conductor Equipment is the second part of semiconductor devices where single devices such as capacitors, transistors and resistors, among others are interconnected by wires on wafer which are made by pure silicon and metal layers to form required electrical circuits. Common metal that forms layers are aluminum interconnect and copper interconnect. Back end of the line in semiconductor equipments is started when the wafer gets deposited by the first layer of metal. Back end of line consists of metal levels, insulating layers (dielectrics), and bonding sites for chip to package connections. In back end of the line the formation of interconnect wires, contacts (pads), and dielectric structures takes place. Ten metal layers or more are added in back end of the line stage in semiconductor electronics. Steps of back end of line includes silicidation of the polysilicon region, drain regions and source, addition of dielectric and its processing, making holes in PMD in order to make contacts in them, adding the first metal layer, addition of second dielectric, connection of lower metal with higher metal by making vias through dielectric and passivation layer addition in order to protect the micro chip.
This market research analysis identifies the miniaturization of electronic devices as one of the primary growth factors for this market. The recent years have seen an increasing demand for compact electronic devices from several sectors such as communication, automotive, industrial manufacturing, and healthcare. This has induced the semiconductor manufacturers to invest in their R&D to reduce the size and increase the performance of ICs, which, in turn, has led to the emergence of micro-electro-mechanical systems (MEMS) and 3D chip packaging. Also, the increasing number of interconnects and transistors in the existing space on the ICs requires finer deposition, which in turn, will create the demand for BEOL semiconductor equipment. In addition, increasing technological functionalities in mobile devices is a major driver driving the global back end of the line semiconductor equipments market. Asia Pacific is expected to dominate the market share of the back end of the line semiconductor equipment global market.

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The global Back End of the Line Semiconductor Equipment market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Back End of the Line Semiconductor Equipment volume and value at global level, regional level and company level. From a global perspective, this report represents overall Back End of the Line Semiconductor Equipment market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The following manufacturers are covered:
Applied Materials
ASML
KLA-Tencor
Tokyo Electron Limited (TEL)
...

Segment by Regions
North America
Europe
China
Japan

Segment by Type
CVD
CMP
Coater Developer
PVD
Metal Etching
Stepper
Wet Station

Segment by Application
Foundry
Memory
IDM

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In this study, the years considered to estimate the market size of Back End of the Line Semiconductor Equipment are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025

This report includes the estimation of market size for value (million USD) and volume (K sqm). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Back End of the Line Semiconductor Equipment market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

Click to view Tables, Charts, Figures, TOC, and Companies Mentioned in the global GaN Devices market Report: https://www.qyresearch.com/index/detail/987755/global-back-end-of-the-line-semiconductor-equipment-market

For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Key Stakeholders
Raw material suppliers
Distributors/traders/wholesalers/suppliers
Regulatory bodies, including government agencies and NGO
Commercial research & development (R&D) institutions
Importers and exporters
Government organizations, research organizations, and consulting firms
Trade associations and industry bodies
End-use industries

Available Customizations
With the given market data, QYResearch offers customizations according to the company's specific needs. The following customization options are available for the report:
Further breakdown of Back End of the Line Semiconductor Equipment market on basis of the key contributing countries.
Detailed analysis and profiling of additional market players.

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