Global IO Link Market Analysis 2019 Top Companies are are Siemens AG, Balluff GmbH, ifm electronic gmbh, SICK AG, Rockwell Automation Inc., Festo AG & Co. KG., OMRON Corporation, Banner Engineering Corporation, Hans Turck GmbH & Co. KG

This Global IO Link Market research report is generated by using integrated approaches and latest technology for the best results. Proficient capabilities and excellent resources in research, data collection, development, consulting, evaluation, compliance and regulatory services come together to generate this world-class market research report. If your business is hunting to gain competitive advantage in this swiftly transforming marketplace, then plumping for this Global IO Link Market research report is highly recommended as it gives lot of benefits for a thriving business. It provides the supreme base for the competitor analysis, comprehensively analysing their core competencies, and drawing a competitive landscape for the market and Semiconductors and Electronics industry.

The Global IO Link Market is expected to rise from its initial estimated value of USD 2.46 billion in 2018 to an estimated value of USD 26.80 billion by 2026 registering a CAGR of 34.75% in the forecast period of 2019-2026. This trend in growth can be attributed to the focus on optimisation of energy that can be achieved with the ability of IO Link supporting several communication protocols at once.

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Global IO Link Market, By Component (IO-Link Masters, IO-Link Devices), By Application (Machine Tool, Handling and Assembly Automation, Packaging, Intralogistics), By Industry (Discrete, Hybrid, Process), By Geography (North America, South America, Europe, Asia-Pacific, Middle East and Africa)– Industry Trends and Forecast to 2026

Competitive Analysis:

The Global IO Link Market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of IO Link Market for global, Europe, North America, Asia Pacific and South America.

Major Market Competitors/Players: Global IO Link Market

Few of the major competitors currently working in the IO Link Market are Siemens AG, Balluff GmbH, ifm electronic gmbh, SICK AG, Rockwell Automation Inc., Festo AG & Co. KG., OMRON Corporation, Banner Engineering Corporation, Hans Turck GmbH & Co. KG, Pepperl+Fuchs, Datalogic S.p.A., Comtrol, Beckhoff Automation GmbH & Co. KG, Baumer, Bosch Rexroth AG, ABB, Belden Inc., AVENTICS GmbH, and Weidmüller Interface GmbH & Co. KG.

Table of Contents:

1. Introduction
2. Market Segmentation
3. Market Overview
4. Executive Summary
5. Premium Insights
6. By Component
7. Product Type
8. Delivery
9. Industry Type
10. Geography
10.1. Overview
10.2. North America
10.3. Europe
10.4. Asia-Pacific
10.5. South America
10.6. Middle East & Africa
11. Company Landscape
12. Company Profiles
13. Related Reports

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Market Definition:

IO Link is an industrial communication networking device that is used for interlinking sensors to a high level fieldbus or ethernet communication protocol. It provides the data from these sensors that can be used for monitoring and hence, helps in optimizing the resources being utilized in the said industry.

Market Drivers:

• Focus on optimal utilization of resources and increase of energy efficiency is expected to drive the market growth
• IO Link’s ability in supporting several Fieldbus and Ethernet communication protocols

Market Restraints:

• IO Link’s usage and effectiveness is limited in the cases of high-speed or motion control applications is expected to restrain the market growth
• Lack of standardization of IO Links is another factor that is expected to restrain the market growth

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Segmentation:

• By Component
o IO-Link Masters
o IO-Link Devices
 Sensor Nodes
 Modules
 Actuators
 Radio-Frequency Identification (RFID) Read Heads and Others

• By Application
o Machine Tool
o Handling and Assembly Automation
o Packaging
o Intralogistics

• By Industry
o Discrete
o Hybrid
o Process

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