IO Link Market Analysis 2019 Rising Trends and New Technologies with Leading Players: Siemens AG, Balluff GmbH, ifm electronic gmbh, SICK AG, Rockwell Automation Inc., Festo AG & Co. KG., OMRON Corporation, Banner Engineering Corporation, And Others

While preparing this finest IO Link market research report, proficient team and their potential capabilities have been employed. To keep marketplace clearly into focus, the analysis of Abc industry has been performed in this report which is based on most up to date market insights. The major features of this report are; comprehensive and distinct analysis of the market drivers and restraints, top market players involved in this industry, thorough analysis of the market segmentation, and competitive analysis of the key players. Data collection modules with big sample sizes have been utilized in this report for collecting data and performing base year analysis. The market research data explored in this IO Link report is analyzed and forecasted using market statistical and coherent models.

Furthermore, two more major success factors of this IO Link market report are market share analysis and key trend analysis. The research methodology applied throughout the report by DBMR research team is data triangulation which includes data mining, studying the impact of data variables on the market, and primary validation by industry experts. Being proficient and all-inclusive in nature, this report focuses on primary and secondary market drivers, market shares, leading segments and geographical analysis. With the nice mixture of integrated approaches and latest technology, best results are accomplished in the form of this IO Link market research report.

Market Analysis: Global IO Link Market

Global IO Link Market is expected to rise from its initial estimated value of USD 2.46 billion in 2018 to an estimated value of USD 26.80 billion by 2026 registering a CAGR of 34.75% in the forecast period of 2019-2026. This trend in growth can be attributed to the focus on optimisation of energy that can be achieved with the ability of IO Link supporting several communication protocols at once.

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Competitive Analysis: Global IO Link Market

The Global IO Link Market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of IO Link Market for global, Europe, North America, Asia Pacific and South America.

Major Market Competitors/Players: Global IO Link Market

Few of the major competitors currently working in the IO Link Market are Siemens AG, Balluff GmbH, ifm electronic gmbh, SICK AG, Rockwell Automation Inc., Festo AG & Co. KG., OMRON Corporation, Banner Engineering Corporation, Hans Turck GmbH & Co. KG, Pepperl+Fuchs, Datalogic S.p.A., Comtrol, Beckhoff Automation GmbH & Co. KG, Baumer, Bosch Rexroth AG, ABB, Belden Inc., AVENTICS GmbH, and Weidmüller Interface GmbH & Co. KG.

Table of Contents: Global IO Link Market

1. Introduction
2. Market Segmentation
3. Market Overview
4. Executive Summary
5. Premium Insights
6. By Component
7. Product Type
8. Delivery
9. Industry Type
10. Geography
10.1. Overview
10.2. North America
10.3. Europe
10.4. Asia-Pacific
10.5. South America
10.6. Middle East & Africa
11. Company Landscape
12. Company Profiles
13. Related Reports

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Market Drivers: Global IO Link Market

• Focus on optimal utilization of resources and increase of energy efficiency is expected to drive the market growth

• IO Link’s ability in supporting several Fieldbus and Ethernet communication protocols

Market Restraints:

• IO Link’s usage and effectiveness is limited in the cases of high-speed or motion control applications is expected to restrain the market growth

• Lack of standardization of IO Links is another factor that is expected to restrain the market growth

Segmentation: Global IO Link Market

By Component
o IO-Link Masters
o IO-Link Devices
 Sensor Nodes
 Modules
 Actuators
 Radio-Frequency Identification (RFID) Read Heads and Others

By Application
o Machine Tool
o Handling and Assembly Automation
o Packaging
o Intralogistics

By Industry
o Discrete
o Hybrid
o Process

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