Asia-Pacific Semiconductor Packaging and Assembly (P&A) Equipment Market Top Key players Some of the key players in the market include Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation & more

The Asia-Pacific Semiconductor packaging and assemble equipment market is anticipated to grow at a CAGR of 5.6% during the analysed period 2019-2025. Increase use of semiconductor chip in daily used equipment’s are the major factor driving the market. Semiconductors form the foundation of all the electronics that we use in our daily lives. From alarm clock to microwave to the cell phone and laptop that enable our workday, most of the things in our surrounding are powered by semiconductor chips. The Asia Pacific is the biggest semiconductor industry across the globe and it is growing rapidly owing to the high penetration of integrated semiconductor chips across all the industry verticals. The increasing usage of semiconductor integrated chip across several industry segments like mobile and consumer electronic devices, automobiles, medical equipment, high definition television, and laptops has increased the requirement of packaging and assembly equipment.

The presence of many major players in the Asian region further boosts the market. The Internet of Things and automation in automobiles have boosted the semiconductor market which in return propels the packaging and assembling equipment industry in Asian countries. The usage of semiconductor ICs for automated driving, automatic braking system, GPS, power doors and windows bring high potential in the market. However, the requirement of heavy investments, trade war and fluctuating foreign exchange rates are hampering the market. Inspite of this, the favourable government policies and increasing usage of automation in countries such as China and Taiwan are anticipated to be a key opportunity areas for the players in the industry.

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The semiconductor packaging and assembly equipment market is segmented on the basis of process type and application areas. There are a number of packaging and assembly equipment processes adopted in the industry, such as plating, inspection and dicing, wire bonding, die-bonding, and others. The Die bonding held the major share in 2018. On the other hand, plating process is anticipated to be the fastest growing segment during the forecast period (2019-2025). On the basis of application, the market is bifurcated into consumer electronics, communication, automotive, industrial and others. In 2018, communications held the major share of the Asian semiconductor packaging and assembly equipment market. However, owing to the increase in demand of advanced electronics due to growing electrification and automation of automobiles, automotive application segment is anticipated to show a remarkable CAGR during the forecast period.

Further, semiconductor packaging and assembly market report is bifurcated across several countries. This includes China, Japan, India, South Korea, Singapore, Taiwan and the rest of APAC. Taiwan.

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dominated the market in 2018 and is expected to maintain its dominance while, China is expected to showcase a notable CAGR during the forecast period. The governmental funds and policies such as the National Fund and local Integrated Circuits (IC) funds, created in 2014, and the Made in China 2025 policy are some of the major reasons fuelling the demand within China.

Competitive Landscape-Top 10 Market Players

Some of the key players in the market include Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics, Jiangsu Changjiang Electronics Technology Co., Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group. These players are adopting several market strategies, such as merger & acquisition, business expansion and collaboration, among others to strengthen their foothold in the industry.

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