Press release
Wafer-level Packaging Equipment Market Size, Share, Development by 2024
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https://www.globalinforesearch.com/global-wafer-level-packaging-equipment-market_p108642.html
Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process.
Scope of the Report:
In the recent years, wafer-level packaging equipment production value showed a trend of steady growth. At present, the major manufacturers of wafer-level packaging equipment are concentrated in North America, EU, and Japan. Applied Materials is the world's largest wafer-level packaging equipment producer.
Wafer-level packaging equipment is very expensive, usually it does not go through the distributor and provided by the manufacturer directly to the customer.
The worldwide market for Wafer-level Packaging Equipment is expected to grow at a CAGR of roughly 8.9% over the next five years, will reach 3090 million US$ in 2024, from 2010 million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Wafer-level Packaging Equipment in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
Applied Materials
Tokyo Electron
KLA-Tencor Corporation
EV Group
Tokyo Seimitsu
Disco
SEMES
Suss Microtec
Ultratech
Rudolph Technologies
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
Fan In
Fan Out
Market Segment by Applications, can be divided into
Integrated Circuit Fabrication Process
Semiconductor Industry
Microelectromechanical Systems (MEMS)
Other
For More Information On This Report, Please Visit @
https://www.globalinforesearch.com/global-wafer-level-packaging-equipment-market_p108642.html
Related Information:
North America Wafer-level Packaging Equipment Market Growth 2019-2024
United States Wafer-level Packaging Equipment Market Growth 2019-2024
Asia-Pacific Wafer-level Packaging Equipment Market Growth 2019-2024
Europe Wafer-level Packaging Equipment Market Growth 2019-2024
EMEA Wafer-level Packaging Equipment Market Growth 2019-2024
Global Wafer-level Packaging Equipment Market Growth 2019-2024
China Wafer-level Packaging Equipment Market Growth 2019-2024
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