Press release
Back Grinding Tapes Market It Is Expected to Reach 250 million US$ by the End of 2025, with a CAGR of 4.7% Between 2019 and 2025 - QY Research
BGT(Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.At present, the Back Grinding Tapes industry is generally at a more advanced level in Japan, the world's large enterprises are mainly concentrated in Japan. Meanwhile, Japan companies have more advanced equipment, strong R & D capability, the technical level is in a leading position.
Access PDF of this report at: https://www.qyresearch.com/sample-form/form/1091180/global-back-grinding-tapes-market
There are major two classification of Back Grinding Tapes in this report, UV Type BGT, Non-UV Type BGT. Globally, the production value share of each type of Back Grinding Tapes is 40.46% and 59.54% in 2017.
The global Back Grinding Tapes market was 170 million US$ in 2018 and is expected to 250 million US$ by the end of 2025, growing at a CAGR of 4.7% between 2019 and 2025.
This report studies the Back Grinding Tapes market size (value and volume) by players, regions, product types and end industries, history data 2014-2018 and forecast data 2019-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of Back Grinding Tapes in these regions, from 2014 to 2025, covering
North America (United States, Canada and Mexico)
Europe (Germany, UK, France, Italy, Russia and Turkey etc.)
Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)
South America (Brazil etc.)
Middle East and Africa (Egypt and GCC Countries)
The various contributors involved in the value chain of the product include manufacturers, suppliers, distributors, intermediaries, and customers. The key manufacturers in this market include
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
By the product type, the market is primarily split into
UV Type
Non-UV Type
By the end users/application, this report covers the following segments
Standard
Standard Thin Die
(S)DBG(GAL)
Bump
We can also provide the customized separate regional or country-level reports, for the following regions:
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Singapore
Malaysia
Philippines
Thailand
Vietnam
Rest of Asia-Pacific
Europe
Germany
France
UK
Italy
Spain
Russia
Rest of Europe
Central & South America
Brazil
Rest of Central & South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa
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