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Leading report says “The Wafer Level Packaging market is valued at $4.7 bn in 2019”.

03-22-2019 12:29 PM CET | Business, Economy, Finances, Banking & Insurance

Press release from: visiongain

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Access your free sample pages here

Visiongain has launched a new packaging report: Global Wafer Level Packaging Market 2019-2029: Forecasts by Packaging Technology (3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP and Others), by Integration Type (Fan-in WLP and Fan-out WLP) and by Industry (Electronics, IT & Telecommunication, Industrial, Automotive, Aerospace & Defence, Healthcare and Others) Plus Profiles of Leading Companies and Regional and Leading National Market Analysis.
London, UK, March 22, 2019 (GLOBE NEWSWIRE) -- The Visiongain report analyst commented “Wafer Level Packaging market is expected to witness a high growth on account of ongoing increased current and emerging applications, increased technological advancement. In addition, the rapidly expanding trend of thin and lightweight mobile devices and Increased penetration of electronic design automation in the automotive industry are main driving forces for the wafer level packaging market during the forecast period. The Wafer Level Packaging market is also driven by key strategies adopted by the key players in this industry such as product enhancement; acquisitions & mergers; agreements & collaborations; and expansion. Product enhancement was the most commonly adopted strategy by the leading players in Wafer Level Packaging market.”

For free sample pages on this report please click on:
https://www.visiongain.com/report/wafer-level-packaging-market-report-2019-2029/

If you are interested in a more detailed overview of this report, please send an e-mail to sara.peerun@visiongain.com or call her on +44 20 7549 9987

Leading companies featured in the report who are manufacturing Wafer Level Packaging include Amkor Technology, Inc, Applied Materials, Inc, ASML Holding N.V., Deca Technologies Inc., Fujitsu Limited, Jiangsu Changjiang Electronics Technology Co., Ltd., KLA-Tencor Corporation, Lam Research Corporation, Qualcomm Technologies, Inc., Rudolph Technologies, Inc., Siliconware Precision Industries Co., Ltd., Toshiba Electronic Devices & Storage Corporation, Tokyo Electron Limited and Ultratech, Inc

Notes for Editors
If you are interested in a more detailed overview of this report, please send an e-mail to sara.peerun@visiongain.com or call her on +44 20 7549 9987

Sara Peerun
sara.peerun@visiongain.com
+44 20 7549 9987

Visiongain is one of the fastest-growing and most innovative independent media companies in Europe. Based in London, UK, Visiongain produces a host of business-to-business reports focusing on the automotive, aviation, chemicals, cyber, defence, energy, food & drink, materials, packaging, pharmaceutical and utilities sectors.

Visiongain publishes reports produced by analysts who are qualified experts in their field. Visiongain has firmly established itself as the first port of call for the business professional who needs independent, high-quality, original material to rely and depend on.

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