Global Solder Ball Market Analysis by Market Segment, Demand, Trend, Forecast| Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal.

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.

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Scope of the Report:

Asia Pacific held the leading share of the market in terms of revenue in 2016. We estimate that the global market share of Solder Ball is 27.66% in Taiwan, 20.54% in Korea, 17.28% in Japan, 15% in China and 10.56% in South East Asia. Because there are many larger IC packaging (including testing) companies in these region, such as ASE, Amkor, SPIL etc. Solder Ball are most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.

Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market in 2016. Senju Metal dominated with 40.00% revenue share, followed by DS HiMetal with 19.14% revenue share and MKE with 7.08% revenue share.
The worldwide market for Solder Ball is expected to grow at a CAGR of roughly 6.6% over the next five years, will reach 310 million US$ in 2024, from 210 million US$ in 2019, according to a new GIR (Global Info Research) study.

This report focuses on the Solder Ball in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers
Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology

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Table of Contents

1 Market Overview
1.1 Solder Ball Introduction
1.2 Market Analysis by Type
1.2.1 Lead Solder Ball
1.2.2 Lead Free Solder Ball
1.3 Market Analysis by Applications
1.3.1 BGA
1.3.2 CSP & WLCSP
1.3.3 Flip-Chip & Others
1.4 Market Analysis by Regions
1.4.1 North America (United States, Canada and Mexico)
1.4.1.1 United States Market States and Outlook (2014-2024)
1.4.1.2 Canada Market States and Outlook (2014-2024)
1.4.1.3 Mexico Market States and Outlook (2014-2024)
1.4.2 Europe (Germany, France, UK, Russia and Italy)
1.4.2.1 Germany Market States and Outlook (2014-2024)
1.4.2.2 France Market States and Outlook (2014-2024)
1.4.2.3 UK Market States and Outlook (2014-2024)
1.4.2.4 Russia Market States and Outlook (2014-2024)
1.4.2.5 Italy Market States and Outlook (2014-2024)
1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
1.4.3.1 China Market States and Outlook (2014-2024)
1.4.3.2 Japan Market States and Outlook (2014-2024)
1.4.3.3 Korea Market States and Outlook (2014-2024)
1.4.3.4 India Market States and Outlook (2014-2024)
1.4.3.5 Southeast Asia Market States and Outlook (2014-2024)
1.4.4 South America, Middle East and Africa
1.4.4.1 Brazil Market States and Outlook (2014-2024)
1.4.4.2 Egypt Market States and Outlook (2014-2024)
1.4.4.3 Saudi Arabia Market States and Outlook (2014-2024)
1.4.4.4 South Africa Market States and Outlook (2014-2024)
1.4.4.5 Turkey Market States and Outlook (2014-2024)
1.5 Market Dynamics
1.5.1 Market Opportunities
1.5.2 Market Risk
1.5.3 Market Driving Force
2 Manufacturers Profiles
2.1 Senju Metal
2.1.1 Business Overview
2.1.2 Solder Ball Type and Applications
2.1.2.1 Product A
2.1.2.2 Product B
2.1.3 Senju Metal Solder Ball Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
2.2 DS HiMetal
2.2.1 Business Overview
2.2.2 Solder Ball Type and Applications
2.2.2.1 Product A
2.2.2.2 Product B
2.2.3 DS HiMetal Solder Ball Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
2.3 MKE
2.3.1 Business Overview
2.3.2 Solder Ball Type and Applications
2.3.2.1 Product A
2.3.2.2 Product B
2.3.3 MKE Solder Ball Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
2.4 YCTC
2.4.1 Business Overview
2.4.2 Solder Ball Type and Applications
2.4.2.1 Product A
2.4.2.2 Product B
2.4.3 YCTC Solder Ball Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)

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