The Chip On Flex Market is Projected to Reach 2030 Million US$ by 2025 at a CAGR of 4.5%, says New Research Report

Chip-on-Flex, or COF, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit (a circuit built on a flexible substrate instead of the usual printed circuit board). Thus, in a COF assembly, the microchip doesn't have to go through all the traditional assembly steps required for individual IC packaging. This simplifies the over-all process of designing and manufacturing the final product while improving its performance as a result of the shorter interconnection paths.

COF is the role of product through the flexible substrate and connected to on-chip liquid crystal panel, the liquid crystal panel and the control chip driver current, voltage, thus changing the state of the liquid crystal display different screens. Currently, COF products are widely used in LCD TVs, smart 3G phones and laptop computers and other products with LCD display driver.

Driven by a growing range of applications in the automotive, industrial, military, aerospace, computer, telecommunication, consumer electronics, and medical electronics industries, miniaturization and the use of flex circuits continue to be of prime interest to electronics manufacturers.

In China, COF manufactures mainly include Danbond Technology, AKM Industrial, Compass Technology Company and others. China is the world’s third producer of COF and the world’s biggest consumption market.

The Chip On Flex (COF) market was valued at 1490 Million US$ in 2018 and is projected to reach 2030 Million US$ by 2025, at a CAGR of 4.5% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Chip On Flex (COF).

This report studies the global Chip On Flex (COF) market size of Chip On Flex (COF) in key regions like North America, Europe, Asia Pacific, Central & South America and Middle East & Africa, focuses on the consumption of Chip On Flex (COF) in these regions.

The following manufacturers are covered in this report, with sales, revenue, market share for each company: LGIT, Stemco, Flexceed, Chipbond Technology, CWE, Danbond Technology, AKM Industrial, Compass Technology Company, Compunetics, STARS Microelectronics etc.

It also provides Chip On Flex (COF) breakdown data by types like Single sided COF, Others and by applications like Military, Medical, Aerospace, Electronics, Other.

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Major Points from Table of Contents
1 Study Coverage
2 Executive Summary
3 Market Size by Manufacturers
4 Chip On Flex (COF) Production by Regions
5 Chip On Flex (COF) Consumption by Regions
6 Market Size by Type
7 Market Size by Application
8 Manufacturers Profiles
9 Production Forecasts
10 Consumption Forecast
11 Value Chain and Sales Channels Analysis
12 Market Opportunities & Challenges, Risks and Influences Factors Analysis
13 Key Findings in the Global Chip On Flex (COF) Study
14 Appendix

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