Molded Interconnect Devices (MID) Market Size, Share and Growth Analysis by 2025 - Arlington Plating Company, RTP Company, Multiple Dimensions AG, TEPROSA
Molded Interconnect Devices (MID) allow amalgamation of mechanical as well as electronic components and circuits directly on 3D plastic components. MIDs combine the housing, circuit board, cables, and circuit board that comprise traditional product interfaces and integrate them into a single functional, compact part.
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MIDs offers design flexibility, which helps in space savings in a product by eliminating the need of additional components. This further helps in reducing the overall weight of the product. Further, it helps in reducing assembly times as well as the number of production steps through integration of sensors and circuits. This is anticipated to optimize the additional costs and also enable high quality components manufacturing. Such factors are anticipated to propel the market growth. However, high tooling costs as well as high prices of raw materials required for manufacturing MIDs may hinder the market.
1. TE Connectivity
2. LPKF Laser & Electronics AG
3. Molex, LLC
4. MacDermid, Inc.
5. HARTING Technology Group
6. Arlington Plating Company
7. RTP Company
8. Multiple Dimensions AG
The "Global Molded Interconnect Devices Market Analysis to 2025" is a specialized and in-depth study of the molded interconnect devices industry with a focus on the global market trend. The report aims to provide an overview of global molded interconnect devices market with detailed market segmentation by type, end-user and geography. The global molded interconnect devices market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading market players and offers key trends and opportunities in the market.
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The report analyzes factors affecting market from both demand and supply side and further evaluates market dynamics effecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA and South America after evaluating political, economic, social and technological factors affecting the market in these regions.
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