Semiconductor Manufacturing Equipment Market 2019 Analysis by Tokyo Electron, LAM Research, ASML Holdings, Applied Materials, KLA-Tencor, Screen Holdings, Teradyne, Advantest, Hitachi High-Technologies,Plasma-Therm, Rudolph Technologies, Startup Ecosystem

Semiconductor Manufacturing Equipment Market 2019-2025: The global Semiconductor Manufacturing Equipment Marketwas valued at USD 39.02 billion in 2016 and is set to surpass USD 70.2 billion by 2025, growing at a CAGR of 6.75% from 2017 to 2025.

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Competitive Landscape:
The major players in the market are as follows:
1. Tokyo Electron Limited
2. LAM Research Corporation
3. ASML Holdings N.V.
4. Applied Materials Inc.
5. KLA-Tencor Corporation.
6. Screen Holdings Co., Ltd.
7. Teradyne Inc.
8. Advantest Corporation
9. Hitachi High-Technologies Corporation.
10. Plasma-Therm.
11. Rudolph Technologies, Inc
12. Startup Ecosystem

Semiconductor manufacturing is a complex process where assurance of quality is where crucial. The equipment used ensures wafer fab, assembling of semiconductor parts and testing of the entire device. The market is expected to grow in forecast period due to increasing demand of electronics and gadget services.

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Market Dynamics:
1. Market Drivers
1.1 Growing activities in research and development
1.2 Increasing demand for electric and hybrid vehicles
1.3 Increasing penetration of consumer electronics market
1.4 Growing number of foundries

2. Market Restraints
2.1 High initial cost and maintenance
2.2 Functional defects during manufacturing
2.3 Complexity of devices

Market Segmentation:
1. Global Semiconductor Manufacturing Equipment Market, by Dimension:
1.1 2D
1.2 2.5D
1.3 3D

2. Global Semiconductor Manufacturing Equipment Market, by Fab Facility:
2.1 Automation
2.2 Chemical Control Equipment
2.3 Gas Control Equipment
2.4 Others

3. Global Semiconductor Manufacturing Equipment Market, by Front End Equipment:
3.1 Cleaning Process
3.1.1 Single-Wafer Spray System
3.1.2 Single-Wafer Cryogenic System
3.1.3 Batch Immersion Cleaning System
3.1.4 Batch Spray Cleaning System
3.1.5 Scrubber
3.2 Water Surface Conditioning Equipment
3.2.1 Etching
3.3 Lithography
3.3.1 DUV
3.3.2 EUV
3.4 Others

4. Global Semiconductor Manufacturing Equipment Market, by Back End:
4.1 Dicing Equipment
4.2 Bonding Equipment
4.3 Metrology Equipment
4.4 Test Equipment
4.5 Assembly and Packaging
4.5.1 Assembly
4.5.2 Packaging equipment

5. Global Semiconductor Manufacturing Equipment Market, by Region:
5.1 North America (U.S., Canada, Mexico)
5.2 Europe (Germany, UK, France, Rest of Europe)
5.3 Asia Pacific (China, India, Japan, Rest of Asia Pacific)
5.4 Latin America (Brazil, Argentina, Rest of Latin America)
5.5 Middle East & Africa

These major players have adopted various organic as well as inorganic growth strategies such as mergers & acquisitions, new product launches, expansions, agreements, joint ventures, partnerships, and others to strengthen their position in this market.

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Table of Content

1 INTRODUCTION OF GLOBAL SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
1.1 Overview of the Market
1.2 Scope of Report
1.3 Assumptions

2 EXECUTIVE SUMMARY

3 RESEARCH METHODOLOGY OF VERIFIED MARKET INTELLIGENCE
3.1 Data Mining
3.2 Validation
3.3 Primary Interviews
3.4 List of Data Sources

4 GLOBAL SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKETOUTLOOK
4.1 Overview
4.2 Market Dynamics
4.2.1 Drivers
4.2.2 Restraints
4.2.3 Opportunities
4.3 Porters Five Force Model
4.4 Value Chain Analysis
4.5 Regulatory Framework

5 GLOBAL SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION
5.1 Overview
5.2 2D
5.3 2.5D
5.4 3D

6 GLOBAL SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FAB FACILITY
6.1 Overview
6.2 Automation
6.3 Chemical Control Equipment
6.4 Gas Control Equipment
6.5 Others

7 GLOBAL SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT END EQUIPMENT
7.1 Overview
7.2 Cleaning Process
7.2.1 Single-Wafer Spray System
7.2.2 Single-Wafer Cryogenic System
7.2.3 Batch Immersion Cleaning System
7.2.4 Batch Spray Cleaning System
7.2.5 Scrubber
7.3 Water Surface Conditioning Equipment
7.3.1 Etching
7.4 Lithography
7.4.1 DUV
7.4.2 EUV
7.5 Others

8 GLOBAL SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK END
8.1 Overview
8.2 Dicing Equipment
8.3 Bonding Equipment
8.4 Metrology Equipment
8.5 Test Equipment
8.6 Assembly andPackaging
8.6.1 Assembly
8.6.2 Packaging equipment

9 GLOBAL SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY GEOGRAPHY
9.1 Overview
9.2 North AmericaRegional Market Estimates and Forecasts, 2012 – 2025
9.2.1 U.S.
9.2.2 Canada
9.2.3 Mexico
9.3 EuropeRegional Market Estimates and Forecasts, 2012 – 2025
9.3.1 Germany
9.3.2 U.K.
9.3.3 France
9.3.4 Rest of Europe
9.4 Asia PacificRegional Market Estimates and Forecasts, 2012 – 2025
9.4.1 China
9.4.2 Japan
9.4.3 India
9.4.4 Rest of Asia Pacific
9.5 Latin AmericaRegional Market Estimates and Forecasts, 2012 – 2025
9.5.1 Brazil
9.5.2 Argentina
9.6 Rest of the WorldRegional Market Estimates and Forecasts, 2012 – 2025

10 GLOBAL SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKETCOMPETITIVE LANDSCAPE
10.1 Overview
10.2 Company Market Share
10.3 Vendor Landscape
10.4 Key Development Strategies

11 COMPANY PROFILES
11.1 Tokyo Electron Limited
11.1.1 Overview
11.1.2 Financial Performance
11.1.3 Product Outlook
11.1.4 Key Developments

11.2 LAM Research Corporation
11.2.1 Overview
11.2.2 Financial Performance
11.2.3 Product Outlook
11.2.4 Key Developments

11.3 ASML Holdings N.V.
11.3.1 Overview
11.3.2 Financial Performance
11.3.3 Product Outlook
11.3.4 Key Developments

11.4 AppliedMaterialsInc.
11.4.1 Overview
11.4.2 Financial Performance
11.4.3 Product Outlook
11.4.4 Key Developments

11.5 KLA-Tencor Corporation.
11.5.1 Overview
11.5.2 Financial Performance
11.5.3 Product Outlook
11.5.4 Key Developments

11.6 Screen Holdings Co., Ltd.
11.6.1 Overview
11.6.2 Financial Performance
11.6.3 Product Outlook
11.6.4 Key Developments

11.7 Teradyne Inc.
11.7.1 Overview
11.7.2 Financial Performance
11.7.3 Product Outlook
11.7.4 Key Developments

11.8 Advantest Corporation
11.8.1 Overview
11.8.2 Financial Performance
11.8.3 Product Outlook
11.8.4 Key Developments

11.9 Hitachi High-Technologies Corporation
11.9.1 Overview
11.9.2 Financial Performance
11.9.3 Product Outlook
11.9.4 Key Developments

11.10 Plasma-Therm
11.10.1 Overview
11.10.2 Financial Performance
11.10.3 Product Outlook
11.10.4 Key Developments

11.11 Rudolph Technologies, Inc
11.11.1 Overview
11.11.2 Financial Performance
11.11.3 Product Outlook
11.11.4 Key Developments

11.12 Startup Ecosystem
11.12.1 Overview
11.12.2 Financial Performance
11.12.3 Product Outlook
11.12.4 Key Developments

12 Appendix
12.1 Related Reports

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