Press release
Back Grinding Tapes Market is projected to exhibit a CAGR of 4.7% To Reach 250 million US$ by the end of forecast period 2025
BGT(Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.
At present, the Back Grinding Tapes industry is generally at a more advanced level in Japan, the world's large enterprises are mainly concentrated in Japan. Meanwhile, Japan companies have more advanced equipment, strong R & D capability, the technical level is in a leading position.
There are major two classification of Back Grinding Tapes in this report, UV Type BGT, Non-UV Type BGT. Globally, the production value share of each type of Back Grinding Tapes is 40.46% and 59.54% in 2017.
The global Back Grinding Tapes market is valued at 170 million US$ in 2018 is expected to reach 250 million US$ by the end of 2025, growing at a CAGR of 4.7% during 2019-2025.
This report focuses on Back Grinding Tapes volume and value at global level, regional level and company level. From a global perspective, this report represents overall Back Grinding Tapes market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.
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The following manufacturers are covered:
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
...
Segment by Regions
North America
Europe
China
Japan
Segment by Type
UV Type
Non-UV Type
Segment by Application
Standard
Standard Thin Die
(S)DBG(GAL)
Bump
For the better understanding of the Back Grinding Tapes market, this report has provided a detailed analysis of trends, drivers and restraints that dominate the present market scenario and also the future status of the global Back Grinding Tapes market during the projected period of 2019-2025.While classifying these segments, the expert team of analysts have listed down the relative contribution of each segment for the growth of global Back Grinding Tapes market. Detail information of segments is required to recognize the key trends influencing the global market for Back Grinding Tapes
Each segment of the Back Grinding Tapes market provides an in-depth information on the qualitative and quantitative aspect of the market. While giving a brief idea about the revenue opportunities for all the segments, the Back Grinding Tapes report has also provided the value of absolute dollar opportunity for all the segments over the predicted period of 2019-2025.
Global Back Grinding Tapes Market Competitive Landscape
The report of global Back Grinding Tapes market includes the competitive landscape section which provides the full and in-depth analysis of the current market trends, changing technologies and developments that will be beneficial for the companies, which are competing in the market. The report offers an overview of revenue, demand, and supply of data, futuristic cost, and growth analysis during the projected year.
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