Chip On Flex Market 2017-2021 Global Leaders: Compunetics, LGIT, Stemko group, Flexceed, Chipbond technology, compass technology company

Market Research Future published a research report on “Global Chip On Flex Market Research Report- Forecast to 2021” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2021.

Market Scenario:

Chip-on-Flex refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit which is a circuit built on a flexible substrate instead of the usual printed circuit board. The shorter interconnection paths on chip on flex simplifies the process of designing and manufacturing the product and improving its performance. Chip on flex has some important features such as heat sinks, component assembly, penalization, shielding, over molding and graphic overlay among others which makes it more acceptable among end users such as electronic industry, aerospace, defense and others. The major drivers for the growth of this market are increasing need for small and flexible electronics in various applications such as displays, sensors, lighting, biomedical implants, and radio frequency identification among others and the rapid technological advancements which lead to accurate designs and automated production, of flex circuits that helps to eliminate human errors once involved in hand-built wire harnesses. With the use of these flexible circuit board companies ensure the 100% efficiency in the products, due to which level of fault ratio is drastically reduced. Chip on flex helps in reducing the cost, improving operator ergonomics, amplified product quality and testing repeatability.

Get Sample of Report @ https://www.marketresearchfuture.com/sample_request/2015

The Global Chip on Flex Market is expected to grow from US ~$1437 Million in 2016 to US~$ 1795 Million by 2021, at an estimated CAGR of 4.43%. The growth of this market can be constrained by the increased cost of raw materials in related industries like the electronic industry along with the wide variety of technology used and the consumer needs changing to efficient, cheaper and powerful consumer electronics and mobile technologies.

Segments:

The Global Chip On Flex Market has been segmented on the basis of types, applications and verticals. The types of Chip On Flex are one sided Chip On Flex and others. The applications comprises of static and dynamic flexing. The various verticals of Chip On Flex market are military, medical, aerospace, electronics and others.

Key Players

The prominent players in the market of chip on flex market are – LGIT corporation (U.S.), Stemko group(Korea), Flexceed(Japan) , Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond technology co. ltd.(China), AKM industrial company ltd.(China), compass technology company limited(Hong Kong), Compunetics(U.S.), and Stars microelectronics public company ltd (Thailand) among others.

Market Research Analysis:

Market Research Future Analysis shows that the dynamic flexing used in Chip On Flex will be the highest growing. In dynamic flexing applications, the flexible circuit itself is repeatedly flexed while using the final product. Dynamic flexing is most useful in applications where a high degree of accuracy is needed. It also facilitates those processes where high volume of flexing is required. Dynamic flexing has various applications which majorly include Air bag systems, Bar code equipment, Heart monitors and pacemakers, automotive engine controls, cameras, calculators, motion systems, cell phones and printers among others.

Geographically, Asia pacific is expected to dominate the market owing to presence of China which is the biggest consumption market of Chip On Flex. Taiwan also contributes to growth of Chip On Flex Market in Asia Pacific owing to its economic structure and strong bureaucratic system. Europe will experience a growth due to presence of large automobile industries in the region. With the increasing demand automobiles in the Europe region, the manufacturers have to focus on high quality Chip On Flex components and follow adequate quality assurance procedures. North America region will be followed by Europe in terms of market share.

Get complete Report @ https://www.marketresearchfuture.com/reports/chip-on-flex-market-2015

Intended Audience

• COF manufactures
• Industries such as aerospace, automotive, IT, industrial, and medical, among others
• Government institutions
• Research institutions
• Adhesive manufacturers
• Conductor and insulator manufacturers like silver, copper and others

About Us:

At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.

MRFR team have supreme objective to provide the optimum quality market research and intelligence services to our clients. Our market research studies by products, services, technologies, applications, end users, and market players for global, regional, and country level market segments, enable our clients to see more, know more, and do more, which help to answer all their most important questions.

In order to stay updated with technology and work process of the industry, MRFR often plans & conducts meet with the industry experts and industrial visits for its research analyst members.

Media Contact:

Market Research Future
Office No. 528, Amanora Chambers
Magarpatta Road, Hadapsar,
Pune - 411028
Maharashtra, India
+1 646 845 9312
Email: sales@marketresearchfuture.com

This release was published on openPR.