High-Density Interconnect PCB Market to Reach $22,258.8 Million, Brief Analysis on Top Key players Compeq Manufacturing Co. Ltd, TTM Technologies, Unimicron, AT&S, Ibiden Group, SEMCO, Unitech Printed Circuit Corp., Tripod Technology Corp., DAP Corporatio

In 2017, in terms of revenue, consumer electronics segment dominated the global HDI PCB market in the end-user category. By application, the smartphone & tablet segment is anticipated to dominate the market throughout the forecast period. The key players are adopting new techniques to provide advanced technologies to the customers.

According to a recent report published by Allied Market Research, titled,"HDI PCB Market by End-User and Application: Global Opportunity Analysis and Industry Forecast, 2018 - 2025,"the global HDI PCBs market was valued at $9,491.0 million in 2017 and is projected to reach $22,258.8 million by 2025, growing at a CAGR of 11.1% from 2018 to 2025.

Download PDF Report Sample @ https://www.alliedmarketresearch.com/request-sample/5096?utm_source=OPR

At present, Asia-Pacific dominates the market, followed by Europe. In 2017, China dominated the Asia-Pacific market and Germany led the overall market in Europe. While, in North America, the US dominates the current market.

The factors such as miniaturization of size and lower weight, high efficiency, and growing sales of consumer electronics are expected to drive the global HDI PCB market. However, high construction cost impedes the growth of the global market. In the near future, increasing utilization of HDI technology in automobiles is expected to provide lucrative opportunities for the growth of the global HDI PCB market.

According to Prasad Kakade, Lead Analyst at Allied Market Research, In 2017, in terms of revenue, consumer electronics segment dominated the global HDI PCB market in the end-user category. By application, the smartphone & tablet segment is anticipated to dominate the market throughout the forecast period. The key players are adopting new techniques to provide advanced technologies to the customers.

HDI PCBs enable accommodation of more components on either side of the PCB, which increases its functionality and maximizes the abilities of the products or equipment in which it is incorporated. In addition to the high functionality of the HDI boards, the size and weight of the products are also reduced as compared to the traditional PCBs. These boards are heavily utilized in communication devices such as smartphones and tablets, as these products are small and require high functionality in limited space. Moreover, rising need of better power performance of consumer electronic devices and larger color display demands larger battery space reducing the space for PCBs in these devices, thereby driving the growth of the global HDI PCB market.

Get Customized Report @ https://www.alliedmarketresearch.com/request-for-customization/5096?utm_source=OPR

The HDI PCBs utilize minimum materials and boards for its composition and also increase the efficiency of HDI boards as compared to conventional PCBs. In addition, the time required for the construction of these boards is less that helps faster production. Such functionalities of HDI boards increases the performance of the devices in which it is incorporated. All these factors are expected to drive the growth of the global HDI PCB market.

The growing sales of consumer electronics and a substantial rise in the demand for HDI PCBs in these applications are driving the growth of the global HDI PCB market. Therefore, the consumer electronics industry is becoming one of the important end-user markets for high-density technology. Currently, application of these boards in consumer electronic devices such as smartphones, smart wearables, gaming consoles, tablets, and others are significant. Thereby with increasing demand and production of these devices, the global HDI PCB market is projected to grow in the forecast period.

Table of Content:

Chapter: 1: INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

Chapter: 2: EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

Chapter: 3: MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies

3.3. PORTERS FIVE FORCES ANALYSIS
3.4. MARKET SHARE ANALYSIS (2017)
3.5. MARKET DYNAMICS

3.5.1. Drivers

3.5.1.1. Miniaturization of size and lower weight
3.5.1.2. High efficiency
3.5.1.3. Growing sales of consumer electronics

3.5.2. Restraint

3.5.2.1. High Construction Cost

3.5.3. Opportunities

3.5.3.1. Increase in utilization of HDI technology in automobiles

Chapter: 4: HDI PCB MARKET, BY END-USER

4.1. OVERVIEW
4.2. CONSUMER ELECTRONICS

4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis by country

4.3. AUTOMOTIVE

4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis by country

4.4. INDUSTRIAL ELECTRONICS

4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis by country

4.5. IT & TELECOMMUNICATIONS

4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market analysis by country

4.6. OTHERS

4.6.1. Key market trends, growth factors, and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market analysis by country

Chapter: 5: HDI PCB MARKET, BY APPLICATION

5.1. OVERVIEW
5.2. SMARTPHONE & TABLET

5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis by country

5.3. PC & LAPTOP

5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis by country

5.4. SMART WEARABLE

5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis by country

5.5. OTHERS

5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis by country

Chapter: 6: HDI PCB MARKET, BY REGION

6.1. OVERVIEW
6.2. NORTH AMERICA

6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by End-User
6.2.3. Market size and forecast, by application
6.2.4. Market analysis by country

6.2.4.1. U.S.

6.2.4.1.1. Market size and forecast, by End-User
6.2.4.1.2. Market size and forecast, by application

6.2.4.2. Canada

6.2.4.2.1. Market size and forecast, by End-User
6.2.4.2.2. Market size and forecast, by application

6.2.4.3. Mexico

6.2.4.3.1. Market size and forecast, by End-User
6.2.4.3.2. Market size and forecast, by application

6.3. EUROPE

6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by End-User
6.3.3. Market size and forecast, by application
6.3.4. Market analysis by country

6.3.4.1. U.K.

6.3.4.1.1. Market size and forecast, by End-User
6.3.4.1.2. Market size and forecast, by application

6.3.4.2. Germany

6.3.4.2.1. Market size and forecast, by End-User
6.3.4.2.2. Market size and forecast, by application

6.3.4.3. France

6.3.4.3.1. Market size and forecast, by End-User
6.3.4.3.2. Market size and forecast, by application

6.3.4.4. Russia

6.3.4.4.1. Market size and forecast, by End-User
6.3.4.4.2. Market size and forecast, by application

6.3.4.5. Rest of Europe

6.3.4.5.1. Market size and forecast, by End-User
6.3.4.5.2. Market size and forecast, by application

6.4. ASIA-PACIFIC

6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by End-User
6.4.3. Market size and forecast, by application
6.4.4. Market analysis by country

6.4.4.1. China

6.4.4.1.1. Market size and forecast, by End-User
6.4.4.1.2. Market size and forecast, by application

6.4.4.2. Japan

6.4.4.2.1. Market size and forecast, by End-User
6.4.4.2.2. Market size and forecast, by application

6.4.4.3. India

6.4.4.3.1. Market size and forecast, by End-User
6.4.4.3.2. Market size and forecast, by application

6.4.4.4. South Korea

6.4.4.4.1. Market size and forecast, by End-User
6.4.4.4.2. Market size and forecast, by application

6.4.4.5. Rest of Asia-Pacific

6.4.4.5.1. Market size and forecast, by End-User
6.4.4.5.2. Market size and forecast, by application

6.5. LAMEA

6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by End-User
6.5.3. Market size and forecast, by application
6.5.4. Market analysis by country

6.5.4.1. Latin America

6.5.4.1.1. Market size and forecast, by End-User
6.5.4.1.2. Market size and forecast, by application

6.5.4.2. Middle East

6.5.4.2.1. Market size and forecast, by End-User
6.5.4.2.2. Market size and forecast, by application

6.5.4.3. Africa

6.5.4.3.1. Market size and forecast, by End-User
6.5.4.3.2. Market size and forecast, by application

Chapter: 7: COMPANY PROFILES

7.1. AT&S

7.1.1. Company overview
7.1.2. Company snapshot
7.1.3. Operating business segments
7.1.4. Product portfolio
7.1.5. Business performance
7.1.6. Key strategic moves and developments

7.2. COMPEQ

7.2.1. Company overview
7.2.2. Company snapshot
7.2.3. Product portfolio
7.2.4. Business performance
7.2.5. Key strategic moves and developments

7.3. DAP CORPORATION

7.3.1. Company overview
7.3.2. Company snapshot
7.3.3. Product portfolio
7.3.4. Business performance

7.4. IBIDEN CO., LTD.

7.4.1. Company overview
7.4.2. Company snapshot
7.4.3. Operating business segments
7.4.4. Business performance

7.5. MEIKO ELECTRONICS CO., LTD.

7.5.1. Company overview
7.5.2. Company snapshot
7.5.3. Product portfolio
7.5.4. Business performance
7.5.5. Key strategic moves and developments

7.6. SEMCO

7.6.1. Company overview
7.6.2. Company snapshot
7.6.3. Operating business segments
7.6.4. Product portfolio
7.6.5. Business performance

7.7. TTM TECHNOLOGIES

7.7.1. Company overview
7.7.2. Company snapshot
7.7.3. Operating business segments
7.7.4. Product portfolio
7.7.5. Business performance
7.7.6. Key strategic moves and developments

7.8. TRIPOD TECHNOLOGY

7.8.1. Company overview
7.8.2. Company snapshot
7.8.3. Product portfolio
7.8.4. Business performance

7.9. UNIMICRON

7.9.1. Company overview
7.9.2. Company snapshot
7.9.3. Operating business segments
7.9.4. Product portfolio
7.9.5. Business performance
7.9.6. Key strategic moves and developments

7.10. UNITECH PCB

7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Product portfolio
7.10.4. Business performance

Access Full Summery @ https://www.alliedmarketresearch.com/hdi-pcb-market?utm_source=OPR

About Us

Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Portland, Oregon. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of "Market Research Reports" and "Business Intelligence Solutions.” AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.

We are in professional corporate relations with various companies and this helps us in digging out market data that helps us generate accurate research data tables and confirms utmost accuracy in our market forecasting. Each and every data presented in the reports published by us is extracted through primary interviews with top officials from leading companies of domain concerned. Our secondary data procurement methodology includes deep online and offline research and discussion with knowledgeable professionals and analysts in the industry.

Contact:
David Correa
5933 NE Win Sivers Drive
#205, Portland, OR 97220
United States
Toll Free (USA/Canada):
+1-800-792-5285, +1-503-894-6022, +1-503-446-1141
UK: +44-845-528-1300
Hong Kong: +852-301-84916
India (Pune): +91-20-66346060
Fax: +1?855?550-5975
help@alliedmarketresearch.com
Web: https://www.alliedmarketresearch.com

This release was published on openPR.