Global Epoxy Molding Compounds Market 2019 - Size, Share, Trends & Growth Opportunities

The Epoxy Molding Compounds Market 2019-2026 report presents a widespread and fundamental study of Epoxy Molding Compounds industry along with the analysis of subjective aspects providing key business insights to the readers
EMC (Epoxy Molding Compound) is a semi-conductor encapsulant which is used in most products where semi-conductors are applied, such as general home appliances including mobile phones, refrigerators and TVs, industrial devices and vehicles. With the development of IT technology and the development of electronic products based on modern technologies, the global semi-conductor market is expanding and the EMC demand is increasing.

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Scope of the Report:
The global Epoxy Molding Compounds industry has a high market concentration. The major manufacturers are concentrated in Japan, China and Korea, such as Sumitomo Bakelite, Hitachi Chemical, Chang Chun Group and KCC.
The global consumption of Epoxy Molding Compounds increases from 228.37 K MT in 2017 to 327.15 K MT in 2025, at a CAGR of 4.60%. In 2017, the global Epoxy Molding Compounds consumption market is led by Asia-Pacific and Asia-Pacific is the largest region consumption market, accounting for about 88.01% of global consumption of Epoxy Molding Compounds.
The worldwide market for Epoxy Molding Compounds is expected to grow at a CAGR of roughly 3.7% over the next five years, will reach 2320 million US$ in 2024, from 1940 million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Epoxy Molding Compounds in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers
Sumitomo Bakelite
Hitachi Chemical
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Samsung SDI
Eternal Materials
Jiangsu zhongpeng new material
Shin-Etsu Chemical
Hexion
Nepes
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material

Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
Normal Epoxy Molding Compound
Green Epoxy Molding Compound

Market Segment by Applications, can be divided into
Semiconductor Encapsulation
Electronic Components

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There are 15 Chapters to deeply display the global Epoxy Molding Compounds market.
Chapter 1, to describe Epoxy Molding Compounds Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Epoxy Molding Compounds, with sales, revenue, and price of Epoxy Molding Compounds, in 2017 and 2018;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2017 and 2018;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Epoxy Molding Compounds, for each region, from 2014 to 2019;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2014 to 2019;
Chapter 12, Epoxy Molding Compounds market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024;
Chapter 13, 14 and 15, to describe Epoxy Molding Compounds sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source

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