Global Solder Preform Market 2019 - Harris Products, AIM, Nihon Superior, Fromosol

Solder Preform is pre-forms of solid solder alloys with potential to change the future. Combination of machining technologies such as rolling and pressing are used to process the solder alloy into various shapes like squares, rectangles, washers and discs. Typical sizes range from .010" (.254mm) up to 2" (50.8mm). Smaller and larger sizes, as well as custom shapes, are also available.

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Scope of the Report:
Solder preform offers accurate solder deposition for various soldering processes. Solder preforms have various shape, such as squares, rectangles, washers, discs etc. According to its component, solder preforms can be divided into Au base, Ag based, In based, Sn-Pb as well as other types. When considering the lead content, lead-free has been the prominent trend.
The worldwide market for Solder Preform is expected to grow at a CAGR of roughly 7.6% over the next five years, will reach 550 million US$ in 2024, from 380 million US$ in 2019.
This report focuses on the Solder Preform in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers
Ametek
Alpha
Kester
Indium Corporation
Pfarr
Nihon Handa
SMIC
Harris Products
AIM
Nihon Superior
Fromosol
Guangzhou Xianyi
Shanghai Huaqing
Solderwell Advanced Materials
SIGMA Tin Alloy

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Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
Lead Free
Leaded

Market Segment by Applications, can be divided into
Military & Aerospace
Medical
Semiconductor
Electronics
Other

There are 15 Chapters to deeply display the global Solder Preform market.
Chapter 1, to describe Solder Preform Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Solder Preform, with sales, revenue, and price of Solder Preform, in 2017 and 2018;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2017 and 2018;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Solder Preform, for each region, from 2014 to 2019;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2014 to 2019;
Chapter 12, Solder Preform market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024;
Chapter 13, 14 and 15, to describe Solder Preform sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source

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