Press release
Solder Preform Market Size, Share, Development by 2023
Solder Preform is pre-forms of solid solder alloys with potential to change the future. Combination of machining technologies such as rolling and pressing are used to process the solder alloy into various shapes like squares, rectangles, washers and discs. Typical sizes range from .010" (.254mm) up to 2" (50.8mm). Smaller and larger sizes, as well as custom shapes, are also available.
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Global Solder Preform Market: Forecast by Type / Application / Region
Solder preform offers accurate solder deposition for various soldering processes. Solder preforms have various shape, such as squares, rectangles, washers, discs etc. According to its component, solder preforms can be divided into Au base, Ag based, In based, Sn-Pb as well as other types. When considering the lead content, lead-free has been the prominent trend.
According to this study, over the next five years the Solder Preform market will register a 7.6% CAGR in terms of revenue, the global market size will reach US$ 550 million by 2024, from US$ 380 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Solder Preform business, shared in Chapter 3.
Global Solder Preform Market: Key Players
Ametek
Alpha
Kester
Indium Corporation
Pfarr
Nihon Handa
SMIC
Harris Products
AIM
Nihon Superior
Fromosol
Guangzhou Xianyi
Shanghai Huaqing
Solderwell Advanced Materials
SIGMA Tin Alloy
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Related Information:
United States Solder Preform Market Research Report 2018
Europe Solder Preform Market Research Report 2018
North America Solder Preform Market Research Report 2018
Asia-Pacific Solder Preform Market Research Report 2018
China Solder Preform Market Research Report 2018
EMEA Solder Preform Market Research Report 2018
Global Solder Preform Market Research Report 2018
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