Press release
Wafer Level Packaging (WLP) Market Analysis by 2023 With Trends and Key Players - IQE, Amkor Technology, Inc., SPIL 矽品, TriQuint Semiconductor (now Qorvo, Inc.) and China Wafer Level CSP Ltd.
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In the semiconductor packaging industry, the wafer level packaging market is growing with the fastest rate, due to the increasing demand for smaller, lighter, faster, and less expensive electronic products, with low cost packaging and high performance. The rapid advancements in integrated circuit fabrication are also supporting the growth of the wafer level packaging technology in the semiconductor packaging industry.
On the basis of integration, the global wafer level packaging market can be categorized as fan-out WLP, fan-in WLP, integrated passive device, and through-silicon via. On the basis of technology, the global wafer level packaging market can be categorized as 3D wafer-level packaging, compliant WLP, conventional chip scale package, flip chip, nano wafer level packaging and wafer level chip scale package.
The global wafer level packaging market is also categorized on the basis of applications, as defense and aerospace, consumer electronics, medical, automotive and industrial.
Explore report description @ https://www.psmarketresearch.com/market-analysis/wafer-level-packaging-market
Some of the competitors in the global wafer level packaging market are ChipMOS TECHNOLOGIES INC., IQE PLC, Amkor Technology Inc., Siliconware Precision Industries Co. Ltd., TriQuint Semiconductor Inc., China Wafer Level CSP Co. Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., Powertech Technology Inc., Fujitsu Limited, Chipbond Technology Corporation, Nemotek Technologie S.A. and STATS ChipPAC Ltd.
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