Press release
Flip Chip Technology Market 2019 Global Analysis by Key Leaders: Amkor Technology, STATS ChipPAC, Intel Corporation, Powertech Technology, STMicroelectronics, Texas Instruments, UMC
Market Research Future published a research report on “Flip Chip Technology Market Report- Forecast till 2023” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2023.Market Scenario:
A flip chip is a typical semiconductor device that has been designed to incorporate solder bumps over the connection pads of the IC or micro-electromechanical system (MEMS). This methodology creates a very thorough and reliable connection between the component and the board.
In the development of packaging of electronics, the main aim is to lower cost, increase the packaging density, and improve the performance by maintaining or improving the reliability of the circuits. The concept of the flip-chip process where the semiconductor chip is assembled face down onto the circuit board is ideal for size considerations because there is no extra area needed for contacting on the sides of the component. The performance in high-frequency applications is superior to other interconnection methods because the length of the connection path is minimized. Flip chip bumping is a vital step in the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a spacer to prevent electrical shorts and provides mechanical support.
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The major driving forces of the Flip Chip Technology Market have been the developments in the packaging of electronics like improving performance, maintaining high packaging density and increasing the reliability of circuits. However, the high cost associated with the implementation of the flip chip technology is impeding the growth of the market.
Flip chip technology can be applied to application processor, baseband, PMIC, memory devices, etc. products. For mobile communications, flip chip development is driven by increased device performance and package miniaturization trends, particularly for the CPU or so-called applications processor that powers smartphones and media tablets.
Segmentation:
The global flip chip technology market can be segmented by wafer bumping process, packaging technology, packaging type, product, and application.
Based on the wafer bumping process, the flip chip technology market can be segmented into copper (CU) pillar, lead-free, Tin-lead eutectic solder and gold stud plated solder.
Based on the packaging technology, the flip chip technology market includes 2D, 2.5D, and 3D packaging technology.
Based on the packaging type, the flip chip technology market comprises FC BGA (Flip Chip Ball Grid Array), FC PGA (Flip Chip Pin Grid Array), FC LGA (Flip Chip Land Grid Array), FC QFN (Flip Chip Quad Flat No-Lead), FC SIP (Flip Chip System-In-Package), and FC CSP (Flip Chip-Chip-Scale Package).
Product-based segmentation of the flip chip technology market includes LED, CMOS image sensor, CPU, RF, Analog, Mixed Signal, and Power IC, SoC, and others.
Key Players
Some of the major players in Flip Chip Technology market are Samsung Group (South Korea), Intel Corporation (U.S.), Global Foundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland), Texas Instruments (U.S.) among others.
Regional Analysis:
The global flip chip technology market spans across regions such as North America, Europe, Asia Pacific (APAC), and the Rest-of-the-World (RoW).
The APAC region is leading the market with considerable margin, and its status will remain so during the forecast period. Countries such as China and India have emerged as exceptional manufacturing zones. These countries can further increase the flip chip technology market percolation opportunity. Big names such as Sony and Samsung are also from the region which is taking the market further ahead. North America is the second largest market, and it is due to the presence of a huge number of flip chip technology market behemoths. The region is also investing significantly in research and developments.
Industry Trend:
Tokyo Denkikagaku Kōgyō Corporation (TDK) recently showcased the upgraded model of AFM GGI flip chip model which features new horn designs to provide linear X-Y nozzle movement for die sizes up to 10mm2. This will increase its performance and bring-in a lead-free process.
Kulicke & Soffa Industries announced the launch of Katalyst that boasts of leading-edge technology to provide high accuracy flip chip bonder. Its advanced capabilities ensure better performance in automated ground vehicles (AGV).
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Intended Audience
• Wafer manufacturers
• Raw material and manufacturing equipment suppliers
• Chip manufacturers
• System integrators
• Device manufacturers
• Foundry players
• Distributors and retailers
• Research organizations
About Us:
At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.
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Market Research Future
Office No. 528, Amanora Chambers
Magarpatta Road, Hadapsar,
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+1 646 845 9312
Email: sales@marketresearchfuture.com
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