Global Solder Ball market is valued at 210 million US$ in 2017 and will reach 350 million US$ by the end of 2025, growing at a CAGR of 6.4% during 2018-2025.

This report studies the global Solder Ball market status and forecast, categorizes the global Solder Ball market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in North America, Europe, Japan, China, India, Southeast Asia and other regions (Central & South America, and Middle East & Africa).

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In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as “ball” or “bumps”) is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
Asia Pacific held the leading share of the market in terms of revenue in 2016. We estimate that the global market share of Solder Ball is 27.66% in Taiwan, 20.54% in Korea, 17.28% in Japan, 15% in China and 10.56% in South East Asia. Because there are many larger IC packaging (including testing) companies in these region, such as ASE, Amkor, SPIL etc. Solder Ball are most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market in 2016. Senju Metal dominated with 40.00% revenue share, followed by DS HiMetal with 19.14% revenue share and MKE with 7.08% revenue share.
The global Solder Ball market is valued at 210 million US$ in 2017 and will reach 350 million US$ by the end of 2025, growing at a CAGR of 6.4% during 2018-2025.

The major manufacturers covered in this report
Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology

Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering
North America
Europe
China
Japan
India
Southeast Asia
Other regions (Central & South America, Middle East & Africa)

We can also provide the customized separate regional or country-level reports, for the following regions:
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Singapore
Rest of Asia-Pacific
Europe
Germany
France
UK
Italy
Spain
Russia
Rest of Europe
Central & South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Saudi Arabia
Turkey
Rest of Middle East & Africa

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On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
Lead Solder Ball
Lead Free Solder Ball

By Application, the market can be split into
BGA
CSP & WLCSP
Flip-Chip & Others

Table of Contents

Global Solder Ball Market Professional Survey Report 2018
1 Industry Overview of Solder Ball
1.1 Definition and Specifications of Solder Ball
1.1.1 Definition of Solder Ball
1.1.2 Specifications of Solder Ball
1.2 Classification of Solder Ball
1.2.1 Lead Solder Ball
1.2.2 Lead Free Solder Ball
1.3 Applications of Solder Ball
1.3.1 BGA
1.3.2 CSP & WLCSP
1.3.3 Flip-Chip & Others
1.4 Market Segment by Regions
1.4.1 North America
1.4.2 Europe
1.4.3 China
1.4.4 Japan
1.4.5 Southeast Asia
1.4.6 India

2 Manufacturing Cost Structure Analysis of Solder Ball
2.1 Raw Material and Suppliers
2.2 Manufacturing Cost Structure Analysis of Solder Ball
2.3 Manufacturing Process Analysis of Solder Ball
2.4 Industry Chain Structure of Solder Ball

3 Technical Data and Manufacturing Plants Analysis of Solder Ball
3.1 Capacity and Commercial Production Date of Global Solder Ball Major Manufacturers in 2017
3.2 Manufacturing Plants Distribution of Global Solder Ball Major Manufacturers in 2017
3.3 R&D Status and Technology Source of Global Solder Ball Major Manufacturers in 2017
3.4 Raw Materials Sources Analysis of Global Solder Ball Major Manufacturers in 2017

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